MC74HC112ADTR2G ON Semiconductor, MC74HC112ADTR2G Datasheet - Page 3

MC74HC112ADTR2G

Manufacturer Part Number

MC74HC112ADTR2G

Description

IC FLIP-FLOP DUAL J-K 16TSSOP

Manufacturer

ON Semiconductor

Series

74HCr

Type

JK Typer

Datasheet

1.MC74HC112ADTR2G.pdf (8 pages)

Specifications of MC74HC112ADTR2G

Function

Set(Preset) and Reset

Output Type

Differential

Number Of Elements

Number Of Bits Per Element

Frequency - Clock

28MHz

Delay Time - Propagation

26ns

Trigger Type

Negative Edge

Current - Output High, Low

5.2mA, 5.2mA

Voltage - Supply

2 V ~ 6 V

Operating Temperature

-55°C ~ 125°C

Mounting Type

Surface Mount

Package / Case

16-TSSOP

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î

Î Î Î Î

*Maximum Ratings are those values beyond which damage to the device may occur.

†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C

MAXIMUM RATINGS*

RECOMMENDED OPERATING CONDITIONS

DC ELECTRICAL CHARACTERISTICS

Symbol

Functional operation should be restricted to the Recommended Operating Conditions.

Symbol

out

stg

, V

, t

out

Î Î Î Î Î Î Î Î Î Î Î Î Î Î

Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î

Î Î Î Î Î Î Î Î Î Î

DC Supply Voltage (Referenced to GND)

DC Input Voltage (Referenced to GND)

DC Output Voltage (Referenced to GND)

DC Input Current, per Pin

DC Output Current, per Pin

DC Supply Current, V

Power Dissipation in Still Air

Storage Temperature

Lead Temperature, 1 mm from Case for 10 Seconds

DC Supply Voltage (Referenced to GND)

DC Input Voltage, Output Voltage (Referenced to GND)

Operating Temperature, All Package Types

Input Rise and Fall Time

Minimum High−Level Input

Voltage

Maximum Low−Level Input

Voltage

Minimum High−Level Output

Voltage

Maximum Low−Level Output

Voltage

Maximum Input Leakage Current

Maximum Quiescent Supply

Current (per Package)

SOIC Package: – 7 mW/_C from 65_ to 125_C

TSSOP Package: − 6.1 mW/_C from 65_ to 125_C

(Figure 1)

Parameter

(Plastic DIP, SOIC or TSSOP)

Parameter

and GND Pins

TSSOP Package†

(Voltages Referenced to GND)

Î Î Î Î Î Î Î Î Î

SOIC Package†

out

Plastic DIP†

= V

| v 20 μA

= 0 μA

= 0.1 V or V

Test Conditions

http://onsemi.com

or V

or GND

= 2.0 V

= 4.5 V

= 6.0 V

Î Î Î Î Î

– 1.5 to V

– 0.5 to V

– 0.1 V

– 0.5 to + 7.0

– 65 to + 150

out

Î Î Î

– 55

| v 4.0 mA

| v 5.2 mA

| v 4.0 mA

| v 5.2 mA

Min

2.0

Value

± 20

± 25

± 50

750

500

450

260

Î Î Î Î

Î Î

Î Î Î Î

+ 125

1000

+ 1.5

+ 0.5

Max

500

400

6.0

Î Î Î

Unit

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

4.5

6.0

2.0

4.5

6.0

4.5

6.0

Î Î Î Î Î Î Î Î Î Î

Î Î Î Î

– 55 to

25_C

± 0.1

3.15

3.98

5.48

0.26

1.5

4.2

0.3

0.9

1.2

1.9

4.4

5.9

0.1

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

cuit. For proper operation, V

range GND v (V

tied to an appropriate logic voltage

level (e.g., either GND or V

Unused outputs must be left open.

Guaranteed Limit

Î Î Î Î

out

This device contains protection

Unused inputs must always be

should be constrained to the

v 85_C

± 1.0

3.15

3.84

5.34

0.33

1.5

4.2

0.3

0.9

1.2

1.9

4.4

5.9

0.1

Î Î Î Î

v 125_C

or V

± 1.0

3.15

3.70

5.20

0.40

1.5

4.2

0.3

0.9

1.2

1.9

4.4

5.9

0.1

out

) v V

Î Î Î

Unit

μA

and

MC74HC112ADTR2G ON Semiconductor, MC74HC112ADTR2G Datasheet - Page 3

MC74HC112ADTR2G

Specifications of MC74HC112ADTR2G

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