nssw064t NICHIA CORPORATION, nssw064t Datasheet - Page 6

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nssw064t

Manufacturer Part Number
nssw064t
Description
Specifications For Nichia Chip Type White Led
Manufacturer
NICHIA CORPORATION
Datasheet

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Part Number
Manufacturer
Quantity
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Part Number:
NSSW064T
Manufacturer:
SIL
Quantity:
4 578
(4) Soldering Conditions
Pre-heat
Pre-heat time
Peak
Soldering time
Condition
2.5 ~ 5°C / sec.
· The LEDs can be soldered in place using the reflow soldering method.
· Recommended soldering conditions
temperature
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
· Repairing should not be done after the LEDs have been soldered.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
guarantee on the LEDs after they have been assembled using the dip soldering method.
[Temperature-profile (Surface of circuit board)]
[Recommended soldering pad design]
during air reflow.
top of package.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
a double-head soldering iron should be used.
characteristics of the LEDs will or will not be damaged by repairing.
Although the recommended soldering conditions are specified in the above table, reflow or hand
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
soldering at the lowest possible temperature is desirable for the LEDs.
<
Use the following conditions shown in the figure.
Use the conditions shown to the under figure.
1
: Lead Solder>
2.5 ~ 5°C / sec.
120 ~ 150°C
120sec.Max.
Pre-heating
120 ~ 150°C
120 sec. Max.
240°C Max.
10 sec. Max.
refer to
Temperature
Reflow Soldering
Lead Solder
4
- profile
1.5
The pressure to the top surface will be influence to the reliability of the LEDs.
: Solder resist
It is recommended that the User use the nitrogen reflow method.
9.5
1
60sec.Max.
Above 200
.
1.5
180 ~ 200°C
120 sec. Max.
260°C Max.
10 sec. Max.
refer to
Temperature
(N
Lead-free Solder
°C
4
- profile
2
reflow is
recommended.)
240°C Max.
10sec. Max.
2
.
Temperature
Soldering time
It should be confirmed beforehand whether the
-5-
(Unit : mm)
1~ 5°C / sec.
Hand Soldering
<
2
: Lead-free Solder>
350°C Max.
3 sec. Max.
(one time only)
1~ 5°C / sec.
180 ~ 200°C
120sec.Max.
Pre-heating
When repairing is unavoidable,
Nichia cannot make a
60sec.Max.
Above 220
Nichia STSE-CC7196A
°C
So when using
<Cat.No.070829>
260°C Max.
10sec. Max.

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