ltc4555 Linear Technology Corporation, ltc4555 Datasheet - Page 7

• Manufacturer Part Number: ltc4555
• Description: Sim Power Supply And Level Translator
• Manufacturer: Linear Technology Corporation

PACKAGE DESCRIPTIO
3.50 ± 0.05
2.10 ± 0.05
1.45 ± 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
3.00 ± 0.10
(4 SIDES)
U
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
0.50 BSC
0.25 ±0.05
0.70 ±0.05
PACKAGE OUTLINE
UD Package
0.75 ± 0.05
1.45 ± 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
0.50 BSC
0.25 ± 0.05
1
2
(UD16) QFN 0904
0.40 ± 0.10
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
LTC4555
4555fa
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