MC74LVX574DT ON Semiconductor, MC74LVX574DT Datasheet - Page 7

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MC74LVX574DT

Manufacturer Part Number
MC74LVX574DT
Description
IC FLIP FLOP OCT D 3ST 20-TSSOP
Manufacturer
ON Semiconductor
Series
74LVXr
Type
D-Type Busr
Datasheet

Specifications of MC74LVX574DT

Function
Standard
Output Type
Tri-State Non Inverted
Number Of Elements
1
Number Of Bits Per Element
8
Frequency - Clock
125MHz
Delay Time - Propagation
8.5ns
Trigger Type
Positive Edge
Current - Output High, Low
4mA, 4mA
Voltage - Supply
2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
e
20
1
0.13 (0.005)
Z
b
M
D
0.10 (0.004)
10
11
E
A
H
E
A
1
PACKAGE DIMENSIONS
VIEW P
http://onsemi.com
MC74LVX574
CASE 967−01
SOEIAJ−20
M SUFFIX
M
ISSUE O
_
L
E
7
L
DETAIL P
Q
1
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. TERMINAL NUMBERS ARE SHOWN FOR
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
Y14.5M, 1982.
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
M
A
b
D
E
L
L
Q
Z
c
e
E
1
E
1
12.35
MILLIMETERS
MIN
0.05
0.35
0.18
5.10
7.40
0.50
0.70
1.10
−−−
−−−
0
1.27 BSC
_
12.80
MAX
10
2.05
0.20
0.50
0.27
5.45
8.20
0.85
1.50
0.90
0.81
_
0.002
0.014
0.007
0.486
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0
0.050 BSC
INCHES
_
0.081
0.008
0.020
0.504
0.215
0.323
0.033
0.059
0.035
0.032
MAX
0.011
10
_

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