vemt2520 Vishay, vemt2520 Datasheet - Page 4

• Manufacturer Part Number: vemt2520
• Description: High Speed Infrared Emitting Diodes, 850 Nm, Gaalas, Dh
• Manufacturer: Vishay

VSMG2000X01, VSMG2020X01
Vishay Semiconductors
SOLDER PROFILE
PACKAGE DIMENSIONS in millimeters: VSMG2000
www.vishay.com
4
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
19841
300
250
200
150
100
50
0
0
255 °C
240 °C
217 °C
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
max. 120 s
100
Drawing-No.: 6.544-5391.02-4
Issue: 1; 26.09.08
21517
Time (s)
Cathode
150
For technical questions, contact:
1.7
max. 100 s
max. 30 s
200
High Speed Infrared Emitting Diodes,
max. 260 °C
250
0.4
245 °C
Pin ID
2.3 ± 0.2
5.8 ± 0.2
2.2
6.7
300
850 nm, GaAlAs, DH
Solder pad proposal
acc. IPC 7351
Ø 2.3 ± 0.1
Z
Anode
[e-mail]
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: T
Moisture sensitivity level 2a, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
exposed copper
amb
Z 20:1
< 30 °C, RH < 60 %
Ø 1.8
2.2
± 0.1
Not indicated tolerances ± 0.1
technical drawings
according to DIN
specifications
Document Number: 85194
1.1 ± 0.1
Rev. 1.0, 28-Jan-10