mma3204d Freescale Semiconductor, Inc, mma3204d Datasheet - Page 7

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mma3204d

Manufacturer Part Number
mma3204d
Description
Surface Mount Micromachined Accelerometer
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Sensors
Freescale Semiconductor
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection
interface between the board and the package. With the
Surface mount board layout is a critical portion of the total
SEATING
PLANE
-T-
C
-B-
20
1
K
0.13 (0.005)
D
-A-
20 PL
M
T
G
A
11
10
M
B
J
P
M
0.13 (0.005)
0.080 in.
2.03 mm
Figure 5. Footprint SOIC-20 (Case 475A-01)
10 PL
PACKAGE DIMENSIONS
20-LEAD SOIC
CASE 475A-01
ISSUE A
M
F
R
T
9.65 mm
0.380 in.
X 45˚
A
M
M
B
correct footprint, the packages will self-align when subjected
to a solder reflow process. It is always recommended to
design boards with a solder mask layer to avoid bridging and
shorting between solder pads.
M
1.27 mm
0.050 in.
0.024 in.
0.610 mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
5. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
PROTRUSION.
SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
12.67
10.16
MILLIMETERS
MIN
7.40
3.30
0.35
0.76
0.25
0.10
0.25
1.27 BSC
12.96
10.67
MAX
7.60
3.55
0.49
1.14
0.32
0.25
0.75
DATE 10/01/03
MMA3204D
7

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