sky73085-11 Skyworks Solutions, Inc., sky73085-11 Datasheet - Page 13

• Manufacturer Part Number: sky73085-11
• Description: Sky73085-11 390 ? 500 Mhz High Gain And Linearity Diversity Downconversion Mixer For 2g/3g Base Station Transceiver Applications
• Manufacturer: Skyworks Solutions, Inc.

Component Outline
Note: The cross-hatched area represents the merger of the center
All measurements are in millimeters
6.3
ground pad +10 individual I/O ground pads. All I/O ground
pads should have at least one via connected to internal ground
planes for optimum electrical performance.
6.3
Pin 1
Pitch
Typ
0.5
2X 2.775
Pin 36
200990B • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • April 1, 2009
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
2X 2.775
12X 0.063
Figure 32. PCB Layout Footprint for the SKY73085-11 6 x 6 mm MCM
Metallization
Stencil Aperture
Top View
Top View
6.3
6.3
36X 0.875
0.25 Typ
24X 0.125
Thermal Via Array.
Additional vias in common ground
pad will improve thermal and electrical
performance. NOTE: thermal vias
should be tented and filled with solder
mask, 30-35 μm Cu plating recommended.
12X 0.062
0.3 mm on 0.6 mm pitch.
24X 0.125
Component Outline
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
36X 0.875
6.45
Metallization
Stencil and
Soldermask Opening
DATA SHEET • SKY73085-11 DOWNCONVERSION MIXER
0.15
Solder Mask Opening
Top View
6.45
0.4
SMT Pad Detail
9X This Rotation
9X Rotated 180 o
9X Rotated 90 o CW
9X Rotated 90 o CCW
Scale: 2X
0.075
0.25
0.075
0.75 0.9
Component Outline
Component Outline
3.88
S1125
13