74lvc2g02dp NXP Semiconductors, 74lvc2g02dp Datasheet

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74lvc2g02dp

Manufacturer Part Number
74lvc2g02dp
Description
74lvc2g02 Dual 2-input Nor Gate
Manufacturer
NXP Semiconductors
Datasheet
1. General description
2. Features
The 74LVC2G02 provides a 2-input NOR gate function.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these
devices as translators in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using I
circuitry disables the output, preventing the damaging backflow current through the device
when it is powered down.
74LVC2G02
Dual 2-input NOR gate
Rev. 05 — 4 September 2007
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant outputs for interfacing with 5 V logic
High noise immunity
CMOS low power consumption
Complies with JEDEC standard:
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
ESD protection:
Multiple package options
Specified from 40 C to +85 C and 40 C to +125 C
24 mA output drive (V
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8-B/JESD36 (2.7 V to 3.6 V)
HBM EIA/JESD22-A114E exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V
CC
= 3.0 V)
Product data sheet
OFF
. The I
OFF

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74lvc2g02dp Summary of contents

Page 1

Dual 2-input NOR gate Rev. 05 — 4 September 2007 1. General description The 74LVC2G02 provides a 2-input NOR gate function. Inputs can be driven from either 3 devices. This feature allows the use of ...

Page 2

... Ordering information Type number Package Temperature range Name 74LVC2G02DP +125 C 74LVC2G02DC +125 C 74LVC2G02GT +125 C 74LVC2G02GM +125 C 4. Marking Table 2. Marking Type number 74LVC2G02DP 74LVC2G02DC 74LVC2G02GT 74LVC2G02GM 5. Functional diagram mna716 Fig 1. Logic symbol Fig 3 ...

Page 3

... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 4. Pin configuration TSSOP8 and VSSOP8 74LVC2G02 GND 4 5 001aab643 Transparent top view Fig 5. Pin configuration XSON8 6.2 Pin description Table 3. Pin description Symbol Pin TSSOP8, VSSOP8 GND ...

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... NXP Semiconductors 7. Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level don’t care 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol ...

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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter [ +85 C amb V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage LOW-level output voltage OL I input leakage current ...

Page 6

... NXP Semiconductors Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V HIGH-level output voltage LOW-level output voltage OL I input leakage current I I power-off leakage current V OFF I supply current CC I additional supply current CC [1] All typical values are measured at T ...

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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground 0 V); for test circuit see Symbol Parameter Conditions t propagation delay nA nY; see power dissipation per gate capacitance [1] Typical values are measured at nominal V ...

Page 8

... NXP Semiconductors Table 9. Measurement points Supply voltage 1. 2.7 V 2 3 5.5 V negative positive Test data is given in Table 10. Definitions for test circuit Load resistor Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z ...

Page 9

... NXP Semiconductors 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...

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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...

Page 11

... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 2.0 1.05 mm 0.5 0.04 0.17 1.9 0.95 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...

Page 12

... NXP Semiconductors XQFN8: plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm terminal 1 index area metal area not for soldering 2 1 terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 1.65 1.65 mm 0.5 0.00 0.15 1.55 1.55 OUTLINE VERSION IEC SOT902 Fig 12 ...

Page 13

... Document ID Release date 74LVC2G02_5 20070904 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • In Section 10 “Static current. 74LVC2G02_4 ...

Page 14

... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...

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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 Abbreviations ...

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