adg1206 Analog Devices, Inc., adg1206 Datasheet - Page 19

• Manufacturer Part Number: adg1206
• Description: Low Capacitance, 16- And 8-channel ?15 V/+12 V Icmos? Multiplexers
• Manufacturer: Analog Devices, Inc.

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1206YRUZ
ADG1206YRUZ-REEL7
ADG1206YCPZ-REEL7
ADG1207YRUZ
ADG1207YRUZ-REEL7
ADG1207YCPZ-REEL7
1
Z = Pb-free part.
1
1
1
1
1
1
1.00 MAX
0.85 NOM
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
INDICATOR
BSC
0.45
PIN 1
COPLANARITY
0.15
0.05
12° MAX
PIN 1
SEATING
PLANE
0.10
Figure 40. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 39. 28-Lead Thin Shrink Small Outline Package [TSSOP]
2 8
(TOP VIEW)
1
* EXPOSED
BSC SQ
PAD
5.00
COMPLIANT TO JEDEC STANDARDS MO-153-AE
0.30
0.19
BSC
0.65
* COMPLIANT TO JEDEC STANDARDS MO-220
WITH EXCEPTION TO PADDLE ORIENTATION.
0.80 MAX
0.65 TYP
0.30
0.23
0.18
5 mm × 5 mm Body, Very Thin Quad
Dimensions shown in millimeters
Dimensions shown in millimeters
9.80
9.70
9.60
Description
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Rev. 0 | Page 19 of 20
2.85
2.70 SQ
2.55
0.20 REF
1.20 MAX
SEATING
(CP-32-2)
PLANE
(RU-28)
BSC SQ
0.05 MAX
0.02 NOM
4.75
1 4
1 5
0.20
0.09
COPLANARITY
4.50
4.40
4.30
0.60
0.42
0.24
0.50
0.40
0.30
BSC
0.50
0.05
6.40 BSC
8 °
0 °
17
24
16
25
0.60
0.42
0.24
3.50 REF
BOTTOM
VIEW
0.75
0.60
0.45
32
9
1
8
0.20
MIN
ADG1206/ADG1207
Package Option
RU-28
RU-28
CP-32-2
RU-28
RU-28
CP-32-2