sc14wsmdata Dialog Semiconductor, sc14wsmdata Datasheet - Page 26

• Manufacturer Part Number: sc14wsmdata
• Description: Ultra Low Energy Wireless Sensor Module V1.0
• Manufacturer: Dialog Semiconductor

© 2011 Dialog Semiconductor B.V/
8.0 Package information
8.1
The SC14WSMDATA should be soldered using a
standard reflow soldering profile and lead free solder
paste as shown below. Adjustments to the profile may
be necessary depending on process requirements.
SOLDERING PROFILE
200°
100°
Temp. C°
250°
150°
50°
0°
t1: Max. Change in temperature
t2: Time in preheat (150°C < temp. < 190°C)
t3: Time in reflow zone (temp. > 220°C)
t4: Peak temperature
T1 Preheat zone bottom
T2 Preheat zone top
T3 Reflow zone
T3 220°C
T2 190°C
T1 150°C
Company Confidential
Meltingpoint 217°C
t1
Figure 10 Reflow profile
Reflow profile – leadfree
Sn96.5-Ag3.0-Cu0.5
26
t2
3°C/sec.
60 - 120 sec.
30 - 60 sec.
237°C±5°C
150°C
190°C
220°C
t3
t4
Preliminary December 4, 2012 v1.0
Time