MC10EP31MNR4G ON Semiconductor, MC10EP31MNR4G Datasheet - Page 10

IC FLIP FLOP ECL SET/RST 8-DFN

MC10EP31MNR4G

Manufacturer Part Number
MC10EP31MNR4G
Description
IC FLIP FLOP ECL SET/RST 8-DFN
Manufacturer
ON Semiconductor
Series
10EPr
Type
D-Typer
Datasheet

Specifications of MC10EP31MNR4G

Function
Set(Preset) and Reset
Output Type
Differential
Number Of Elements
1
Number Of Bits Per Element
1
Frequency - Clock
3GHz
Delay Time - Propagation
340ps
Trigger Type
Positive Edge
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-TDFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output High, Low
-
0.15 (0.006) T
0.15 (0.006) T
−T−
0.10 (0.004)
SEATING
PLANE
L
U
U
S
S
PIN 1
IDENT
D
2X
L/2
C
8
1
−V−
A
8x
4
5
K
G
0.10 (0.004)
REF
−U−
B
PACKAGE DIMENSIONS
PLASTIC TSSOP PACKAGE
http://onsemi.com
M
CASE 948R−02
T
DT SUFFIX
U
TSSOP−8
DETAIL E
ISSUE A
S
10
DETAIL E
V
S
F
0.25 (0.010)
M
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
5. TERMINAL NUMBERS ARE SHOWN FOR
6. DIMENSION A AND B ARE TO BE DETERMINED
Y14.5M, 1982.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
REFERENCE ONLY.
AT DATUM PLANE -W-.
DIM
M
A
B
C
D
F
G
K
L
MILLIMETERS
MIN
2.90
2.90
0.80
0.05
0.40
0.25
0
0.65 BSC
4.90 BSC
_
MAX
3.10
3.10
1.10
0.15
0.70
0.40
6
_
0.031
0.002
0.016
0.010
0.114
0.114
MIN
0.026 BSC
0.193 BSC
0
INCHES
_
0.122
0.122
0.043
0.006
0.028
0.016
MAX
6
_

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