ncv8925 ON Semiconductor, ncv8925 Datasheet - Page 3

• Manufacturer Part Number: ncv8925
• Description: 3 Mhz, 600 Ma Step-down Dc-dc Converter
• Manufacturer: ON Semiconductor

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T
2. According to JEDEC standard JESD22-A108B.
3. This device series contains ESD protection and exceeds the following tests:
4. Latchup current maximum rating per JEDEC standard: JESD78.
5. JEDEC Standard: J-STD-020A.
6. In applications with high power dissipation (low V
7. To prevent permanent thermal damages, this device include a thermal shutdown which engages at 180°C (typ).
MAXIMUM RATINGS
Moisture Sensitivity Level (Note 5)
Minimum Voltage All Pins
Maximum Voltage All Pins (Note 2)
Maximum Voltage EN, FB, LX
Thermal Resistance, Junction-to-Air
Operating Ambient Temperature Range (Notes 6 and 7)
Storage Temperature Range
Junction Operating Temperature (Notes 6 and 7)
Latchup Current Maximum Rating (T
ESD Withstand Voltage (Note 3)
considerations - thermal dissipation vias, traces or planes and PCB material - can significantly improve junction to air thermal resistance R
(for more information, see design and layout consideration section). Environmental conditions such as ambient temperature Ta brings thermal
limitation on maximum power dissipation allowed.
The following formula gives calculation of maximum ambient temperature allowed by the application:
(with Recommended Soldering Footprint)
Human Body Model
Machine Model
Human Body Model (HBM) per JEDEC standard: JESD22-A114.
Machine Model (MM) per JEDEC standard: JESD22-A115.
Ta
Where Tj is the junction temperature,
Where
Where
MAX
= Tj
Pd is the maximum power dissipated by the device (worst case of the application),
and R
MAX
qJA
- (R
is the junction-to-ambient thermal resistance.
qJA
x Pd)
Rating
A
= 85°C) (Note 4) Other Pins
IN
, high I
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OUT
NCV8925
), special care must be paid to thermal dissipation issues. Board design
3
TSOP-5
UDFN6
Symbol
V
V
R
V
V
MSL
T
T
Lu
max
max
T
esd
min
qJA
stg
A
j
-40 to 125
-55 to 150
-40 to 150
VIN + 0.3
A
$100
Value
-0.3
= 25°C.
300
220
200
7.0
2.0
1
per IPC
°C/W
Unit
mA
kV
°C
°C
°C
V
V
V
V
qJA