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Features
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Note:
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Benefits
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Die Size
Emiter Pad Size (Included Gate Pad)
Gate Pad Size
Area Total / Active
Thickness
Wafer Size
Flat Position
Maximum-Possible Chips per Wafer
Passivation Frontside
Front Metal
Backside Metal
Die Bond
Reject Ink Dot Size
Recommended Storage Environment
Mechanical Parameter
This IR product is 100% tested at wafer level and is manufactured using established, mature and well characterized processes. Due to
restrictions in die level processing, die may not be equivalent to standard package products and are therefore offered with a conditional
performance guarantee. The above data sheet is based on IR sample testing under certain predetermined and assumed conditions,
and are provided for illustration purposes only. Customers are encouraged to perform testing in actual proposed package and use
conditions. IR die products are tested using IR-based quality assurance procedures and are manufactured using IR’s established
processes. Programs for customer-specified testing are available upon request. IR has experienced assembly yields of generally 95%
or greater for individual die; however, customer’s results will vary. Estimates such as those described and set forth in this data sheet for
semiconductor die will vary depending on a number of packaging, handling, use and other factors. Sold die may not perform on an
equivalent basis to standard package products and are therefore offered with a limited warranty as described in IR’s applicable standard
terms and conditions of sale. All IR die sales are subject to IR’s applicable standard terms and conditions of sale, which are available
upon request. For customers requiring a particular parameter to be guaranteed, special testing can be carried out or product can
bepurchased as known good die.
Technology qualified in sup-TO247 package according to AEC-Q101.
100% Tested at Probe
Designed for Automotive Application
Solderable Front Metal
Low V
Low Switching Losses
Maximum Junction Temperature 175 °C
Short Circuit Rated
Square RBSOA
Positive V
Tight Parameter Distribution
High Efficiency in a Wide Range of Applications
Suitable for a Wide Range of Switching Frequencies
due to Low V
Rugged Transient Performance for Increased
Reliability
Excellent Current Sharing in Parallel Operation
Enables Double side cooling and higher current density
Eliminates wire bonds and Improves Reliability
AUIRG7CH80K6B
Chip Type
CE (on)
CE (on)
Trench IGBT Technology
CE (on)
Temperature Coefficient
and Low Switching Losses
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1200V
VCE
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AUTOMOTIVE GRADE
200A
ICn
Applications
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Medium/High Power Inverters
HEV/EV Inverter
AUIRG7CH80K6B-M
12 X 12 mm2
Al (0.1µm), Ti (0.1µm), Ni (0.4µm), Ag (0.6µm)
<6 months at an ambient temperature of 23°C
Die Size
Al (4µm), Ti (0.1µm), Ni (0.2µm), Ag (0.6µm)
Store in original container, in dry Nitrogen,
Electrically conductive epoxy or solder
Round, 1mm diameter
See Die Drawing
0.51mm min (black, center)
12.075x12.075
G
144/114
n-channel
140
150
Silicon Nitride
0
89 pcs
C
E
Package
Wafer
Degrees
mm2
01/12/10
mm
µm
1