hmc606 Hittite Microwave Corporation, hmc606 Datasheet
hmc606
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hmc606 Summary of contents
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... Supply Voltage: + Ohm Matched Input/Output Die Size: 2.80 x 1.73 x 0.1 mm General Description The HMC606 is a GaAs InGaP HBT MMIC Distributed Amplifi er die which operates between 2 and 18 GHz. With an input signal of 12 GHz, the amplifi er provides ultra low phase noise performance of -160 dBc/ kHz offset, representing a signifi cant improvement over FET-based distributed amplifi ers ...
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... Output Return Loss vs. Temperature 0 -5 -10 -15 -20 -25 - Noise Figure vs. Temperature Order On-line at www.hittite.com HMC606 +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C ...
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... Phase Noise at Psat @ 12 GHz -20 -40 -60 -80 -100 -120 -140 -160 -180 Order On-line at www.hittite.com HMC606 +25C +85C 9 -55C FREQUENCY (GHz FREQUENCY (Hz) ...
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... NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS CONNECTION REQUIRED FOR UNLABELED BOND PADS 3. DIE THICKNESS IS 0.004 (0.100) 4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE 5. BACKSIDE METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND 7. BOND PAD METALIZATION: GOLD Order On-line at www.hittite.com HMC606 1 Icc1 + Icc2 (mA 105 ...
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... GaAs InGaP HBT MMIC ULTRA LOW PHASE NOISE, DISTRIBUTED AMPLIFIER GHz Description This Pad is AC coupled and matched to 50 Ohms from GHz Vcc1= Vcc2= 5V This Pad is AC coupled and matched to 50 Ohms from GHz Order On-line at www.hittite.com HMC606 Interface Schematic ...
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... Thick GaAs MMIC 0.076mm 0.102mm (0.004”) Thick GaAs MMIC 0.076mm 0.150mm (0.005”) Thick Moly Tab Order On-line at www.hittite.com HMC606 Wire Bond (0.003”) RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Wire Bond (0.003” ...