sky65168-11 Skyworks Solutions, Inc., sky65168-11 Datasheet - Page 5

• Manufacturer Part Number: sky65168-11
• Description: Sky65168-11 Medium Power 802.11a Wlan Power Amplifier
• Manufacturer: Skyworks Solutions, Inc.

Evaluation Board Description
The SKY65168-11 Evaluation Board is used to test the
performance of the SKY65168-11 WLAN PA. An assembly
drawing for the Evaluation Board is shown in Figure 9 and the
layer detail is provided in Figure 10. A schematic diagram of the
SKY65168-11 Evaluation Board is shown in Figure 11.
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65168-11 has special electrical
3. Bypass capacitors should be used on the DC supply lines.
4. The RF lines should be well separated from each other with
and thermal grounding requirements. This pad is the main
thermal conduit for heat dissipation. Since the circuit board
acts as the heat sink, it must shunt as much heat as possible
from the device. Therefore, design the connection to the
ground pad to dissipate the maximum wattage produced by
the circuit board. Multiple vias to the grounding layer are
required. For further information, refer to the Skyworks
Application Note PCB Design Guidelines for High Power
Dissipation Packages, document number 201211.
Refer to the schematic drawing in Figure 11 for further details.
solid ground in between traces to maximize input-to-output
isolation.
26.5
26.0
25.5
25.0
24.5
24.0
23.5
23.0
22.5
22.0
–10
–5
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
Figure 7. Gain vs Output Power
201257A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • March 12, 2010
0
(Continuous Wave)
+5
Output Power (dBm)
+10
+15
+20
+25
+30
+35
PRELIMINARY DATA SHEET • MEDIUM POWER 802.11a SKY65168-11 WLAN PA
NOTE: A poor connection between the slug and ground increases
Package Dimensions
The PCB layout footprint for the SKY65168-11 is provided in
Figure 12. Package dimensions for the 16-pin QFN are shown in
Figure 13, and tape and reel dimensions are provided in
Figure 14.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY65168-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 C. It can be used for lead or lead-free soldering.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Discrete Devices and IC Switch/Attenuators
Tape and Reel Package Orientation, document number 200083.
junction temperature (T
device.
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
Figure 8. Detector Voltage vs Output Power
+4
+8
+12
Output Power (dBm)
J
), which reduces the lifetime of the
+16
+20
+24
+28
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