maap-000080-pkg003 M/A-COM, maap-000080-pkg003 Datasheet - Page 7

• Manufacturer Part Number: maap-000080-pkg003
• Description: Amplifier, Power, 2-18
• Manufacturer: M/A-COM

7
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Power, 1 W
2-18 GHz
Assembly and Bonding Diagram
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C
to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compres-
sion wedge bond techniques. For DC pad connections, use either ball or
wedge bonds. For best RF performance, use wedge bonds of shortest
length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
tive bias to V
DD
to prevent
Figure 2. Recommended operational configuration. Wire bond as shown.
RF
IN
V
GG
GG
0.1 μF
before applying posi-
130 Ω
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Visit www.macom.com for additional data sheets and product information.
100 pF
100 pF
0.1 μF
V
DD
RF
OUT
MAAP-000080-DIE000
Preliminary Datasheet
Rev -