GTL2008 Philips Semiconductors (Acquired by NXP), GTL2008 Datasheet - Page 18

• Manufacturer Part Number: GTL2008
• Manufacturer: Philips Semiconductors (Acquired by NXP)

Philips Semiconductors
16. Abbreviations
17. Revision history
Table 18.
GTL2008_GTL2107_2
Product data sheet
Document ID
GTL2008_GTL2107_2
Modifications:
GTL2008_1
Revision history
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Table 17.
Acronym
CDM
CMOS
CPU
DUT
ESD
GTL
HBM
LVTTL
MM
PRR
TTL
VRD
Release date
20060926
20060502
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 C
body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
•
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Added type number GTL2017
Section 1 “General
Section 4 “Ordering
information”
Table 10 “Limiting
“Legal
added “DUT” to
Abbreviations
information”)
GTL translator with power good control and high-impedance outputs
Description
Charged Device Model
Complementary Metal Oxide Semiconductor
Central Processing Unit
Device Under Test
ElectroStatic Discharge
Gunning Transceiver Logic
Human Body Model
Low Voltage Transistor-Transistor Logic
Machine Model
Pulse Rate Repetition
Transistor-Transistor Logic
Voltage Regulator Down
and following paragraph
Data sheet status
Product data sheet
Product data sheet
Rev. 02 — 26 September 2006
Table 17 “Abbreviations”
values”: removed (old) Table note 1 (information is now in
description”: added new 7th paragraph
information”: added type number GTL2107PW to
10 C measured in the atmosphere of the reflow oven. The package
Change notice
-
-
GTL2008; GTL2107
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Supersedes
GTL2008_1
-
Table 2 “Ordering
Section 18
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