2016L030_08 LITTELFUSE [Littelfuse], 2016L030_08 Datasheet - Page 3

• Manufacturer Part Number: 2016L030_08
• Manufacturer: LITTELFUSE [Littelfuse]

Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/2016L.html for current information.
Note: If reflow temperatures exceed the recommended profile,
©2008 Littelfuse, Inc.
Soldering Parameters
Condition
Peak Temp/ Duration Time
Time above liquids (TAL) 220°C
Preheat 120°C~ 180°C
Storage Condition
oven, N
solvents.
Physical Specifications
Terminal Material
Lead Solderability
devices may not meet the performance requirements.
2
environment for lead–free
Solder-Plated Copper (Solder Material:
Matte Tin(Sn))
Meets EIA Specification RS186-9E, ANSI/
J-STD-002 Category 3.
Reflow
260°C / 10 Sec
60 Sec ~ 100 Sec
50 Sec ~ 150 Sec
0°C~35°C, < = 70%RH
Surface Mount > 2016L Series
POLYFUSE
Revised: October 24, 2008
®
Resettable PTCs
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped
State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Vibration
Moisture Sensitivity Level
Environmental Specifications
260
220
180
120
0
Preheating
50 to 150
Soldering
60 to 100
-40°C to +85°C
125°C
+85°C, 1000 hours
-/+5% typical resistance change
+85°C, 85%,R.H.,1000 hours
-/+5% typical resistance change
MIL–STD–202, Method 107G
+85°C/-40°C 20 times
-30% typical resistance change
MIL–STD–202, Method 215
No change
MIL–STD–883C, Method 2007 .1,
Condition A
No change
Level 2, J–STD–020C
Time(s)
120
Cooling
2016L Series