CM3225100KL ABC [ABC Taiwan Electronics Corp], CM3225100KL Datasheet

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CM3225100KL

Manufacturer Part Number
CM3225100KL
Description
WOUND CHIP INDUCTOR
Manufacturer
ABC [ABC Taiwan Electronics Corp]
Datasheet
REF : 20070124-C
AR-001A
PROD.
NAME
Ⅰ﹒CONFIGURATION & DIMENSIONS:
Ⅱ﹒SCHEMATIC DIAGRAM:
Ⅲ﹒MATERIALS:
Ⅳ﹒GENERAL SPECIFICATION:
Inductance code
Marking
20080502-H
a﹒Core:Ferrite DR core
b﹒Wire :Enamelled copper wire (class H)
c﹒Terminal:Cu/Sn
d﹒Encapsulate:Epoxy novolac
a﹒Temp. rise :20℃ max.
b﹒Ambient temp.:100℃ max.
c﹒Storage temp.:-40℃ ----+125℃
d﹒Operating temp.:-40℃----+125℃
e﹒Terminal pull strength:1.5 kg min.
f﹒Rated current:Current cause
g﹒Resistance to solder heat:260℃.10 secs.
h﹒Resistance to solvent:Per MIL-STD-202F
e﹒Remark:Products comply with RoHS' requirements
WOUND CHIP INDUCTOR
F
SPECIFICATION FOR APPROVAL
100
2.9±0.2
inductance drop within 10%
A
F
molding compound
K1 E
B
ABC'S DWG NO.
ABC'S ITEM NO.
K2
Reflow profile
Peak Temp:250℃ max.
Max time above 245℃ :20~40sec max.
Max time above 217℃ :60~150sec max.
200℃~250℃ Average Ramp-up Rate:3℃/second max.
250
245
217
200
150
100
50
0
Temperature
Rising Area
50
※ △
150 ~ 200
A : 3.2±0.4
B : 2.5±0.2
C : 2.2±0.2
E : 1.0±0.2
F : 0.6 +0.3
Preheat Area
K= K1-K2 =0.25
100
( PCB Pattern )
/ 60 ~ 180sec
Time ( seconds )
1
CM3225□□□□L□-□□□
b
1.8
- 0
150
Reflow Area
1
60~150sec
20~40sec
d
200
Peak Temperature
250
m/m
m/m
m/m
m/m
m/m
+0
Forced Cooling Area
a
c
6
m/m
/ second max.
PAGE: 1
250

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CM3225100KL Summary of contents

Page 1

SPECIFICATION FOR APPROVAL 20080502-H REF : 20070124-C PROD. WOUND CHIP INDUCTOR NAME Ⅰ﹒CONFIGURATION & DIMENSIONS: 100 Marking Inductance code 2.9±0 Ⅱ﹒SCHEMATIC DIAGRAM: Ⅲ﹒MATERIALS: a﹒Core:Ferrite DR core b﹒Wire :Enamelled copper wire (class H) c﹒Terminal:Cu/Sn d﹒Encapsulate:Epoxy novolac e﹒Remark:Products comply with ...

Page 2

... CM32254R7KL□ -□□□ CM32255R6KL□ -□□□ CM32256R8KL□ -□□□ CM32258R2KL□ -□□□ CM3225100KL□ -□□□ CM3225120KL□ -□□□ CM3225150KL□ -□□□ CM3225180KL□ -□□□ CM3225220KL□ ...

Page 3

SPECIFICATION FOR APPROVAL 20080502-H 20070124-C REF : PROD. WOUND CHIP INDUCTOR NAME Ⅵ﹒CURVE: @ Inductance VS. DC Superposition Characteristics ...

Page 4

SPECIFICATION FOR APPROVAL 20080502-H REF : 20070813-F PROD. WOUND CHIP INDUCTOR NAME Ⅶ﹒PACKAGING INFORMATION: Configuration 2.0±0.5 ∮ End Leader no component 200 m/m min. There is no differentiation or directions of polarity ( marking ) in the ...

Page 5

SPECIFICATION FOR APPROVAL 20080502-H REF : 20080131-G PROD. WOUND CHIP INDUCTOR NAME Ⅷ﹒DWGING NUMBER EXPRESSION: Appendix code 1:Product Classification L:Lead Free Standard products comply with RoHS' requirements 1 ~ 9:Lead Free Special products comply with ...

Page 6

REF : 20070124-C PROD. WOUND CHIP INDUCTOR NAME Ⅸ﹒RELIABILITY TEST: Test item Specification Electrical performance test Inductance L Q Self resonance frequency SRF Refer to standard electrical DC Resistance RDC characteristic list Rated current IDC Temperature 20 max. ℃ ...

Page 7

SPECIFICATION FOR APPROVAL 20080502-H REF : 20070124-C PROD. WOUND CHIP INDUCTOR NAME Terminal Terminal shall not test strength-pull be loosened or The terminal shall Solderability test be at least 90% covered with solder There shall be no case deformation Resistance ...

Page 8

SPECIFICATION FOR APPROVAL 20080502-H REF : 20070124-C PROD. WOUND CHIP INDUCTOR NAME Ⅹ﹒UL CARD: OBMW2 Magnet Wire-Comporent ELEKTRISOLA (MALAYSLA) SDN BHD IALAN DAMN SATU IANDA BAIK 28750 BENTONG, PAHANG DARUL MAKMUR MALAYSIA Mtl Dsg Estersol 160 Amldester 200 Polysol-N 155 ...

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