L6100140 SEMIKRON [Semikron International], L6100140 Datasheet - Page 3

• Manufacturer Part Number: L6100140
• Description: BOARD 2S SKYPER32 - TECHNICAL EXPLANATIONS
• Manufacturer: SEMIKRON [Semikron International]

Board 2s SKYPER™ 32 -
Application and Handling Instructions
Further application support
Latest information is available at http://www.semikron.com. For design support please read the SEMIKRON
Application Manual Power Modules available at http://www.semikron.com.
General Description
The Board 2s SKYPER™ 32 is an evaluation board for the IGBT module SEMiX
board can be customized allowing adaptation and optimization to the used SEMiX
The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and turn-
off speed by variation of R
for the DSCP (see Technical Explanations SKYPER™ 32).
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Board 2s SKYPER™ 32
Please note:
All values in this technical explanation are typical values. Typical values are the average values expected in large
quantities and are provided for information purposes only. These values can and do vary in different applications. All
operating parameters should be validated by user’s technical experts for each application.
Please note:
This technical explanation is based on the Technical Explanations for SKYPER™ 32. Please read the Technical
Explanations SKYPER™ 32 before using the Evaluation Board.
Please provide for static discharge protection during handling. As long as the hybrid driver is not completely
assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a
grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during
transportation the input terminals have to be short-circuited using, for example, conductive rubber.
Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules.
Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or
RCD-snubber networks between main terminals for PLUS and MINUS of the power module.
When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and
load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the
free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will
be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works
correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector
voltage.
It is important to feed any errors back to the control circuit and to switch off the device immediately in failure
events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V
may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be
avoided.
The connecting leads between hybrid driver and the power module should be as short as possible (max.
20cm), the driver leads should be twisted.
Gon
and R
Goff
. Furthermore, it is possible to adjust the monitoring level and blanking time
2005-06-08 – Rev02
Technical Explanations
®
®
2s (spring contact version). The
Module.
S
+0,3V or below -0,3V
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