ACS174D INTERSIL [Intersil Corporation], ACS174D Datasheet
ACS174D
Manufacturer Part Number
ACS174D
Description
Radiation Hardened Hex D-Type Flip-Flop with Reset
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.ACS174D.pdf
(2 pages)
Radiation Hardened Hex D-Type Flip-Flop
with Reset
The Radiation Hardened ACS174MS is a Hex D-Type Flip-
Flop with Reset. Information at the D input is transferred to
the Q output on the positive-going transition of the clock. All
six flip-flops are controlled by a common clock (CP) and a
common reset (MR). Resetting is accomplished by a LOW
level independent of the clock. All inputs are buffered and
the outputs are designed for balanced propagation delay
and transition times.
The ACS174MS is fabricated on a CMOS Silicon on
Sapphire (SOS) process, which provides an immunity to
Single Event Latch-up and the capability of highly reliable
performance in any radiation environment. These devices
offer significant power reduction and faster performance
when compared to ALSTTL types.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
Detailed Electrical Specifications for the ACS174MS are
contained in SMD 5962-98634. A “hot-link” is provided
on our homepage for downloading.
http://www.intersil.com/spacedefense/spaceselect.htm
Ordering Information
Pinouts
5962F9863401VCC
ACS174D/SAMPLE-03
5962F9863401VXC
ACS174K/SAMPLE-03
5962F9863401V9A
ORDERING NUMBER
GND
MR
Q0
D0
D1
Q1
D2
Q2
1
2
3
4
5
6
7
8
ACS174MS
TOP VIEW
(SBDIP)
1
ACS174DMSR-03
ACS174D/SAMPLE-03
ACS174KMSR-03
ACS174K/SAMPLE-03
ACS174HMSR-03
INTERNAL MARKETING
Data Sheet
16
15
14
13
12
11
10
9
V
Q5
D5
D4
Q4
D3
Q3
CP
CC
NUMBER
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
TEMP. RANGE (
Features
• QML Qualified Per MIL-PRF-38535 Requirements
• 1.25 Micron Radiation Hardened SOS CMOS
• Radiation Environment
• Input Logic Levels. . . . V
• Output Current
• Quiescent Supply Current . . . . . . . . . . . . . . . 10 A (Max)
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . . 23ns (Max)
Applications
• High Speed Control Circuits
• Sensor Monitoring
• Low Power Designs
-55 to 125
-55 to 125
- Latch-Up Free Under Any Conditions
- Total Dose (Max.) . . . . . . . . . . . . . . . . . 3 x 10
- SEU Immunity . . . . . . . . . . . . . <1 x 10
- SEU LET Threshold . . . . . . . . . . . . >100MeV/(mg/cm
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
GND
25
25
25
MR
Q0
Q1
Q2
D0
D1
D2
o
C)
July 1999
16 Ld SBDIP
16 Ld SBDIP
16 Ld Flatpack
16 Ld Flatpack
Die
(FLATPACK)
1
2
3
4
5
6
7
8
ACS174MS
PACKAGE
TOP VIEW
IL
= (0.3)(V
File Number
16
15
14
13
12
11
10
9
ACS174MS
CC
), V
-10
CDIP2-T16
CDIP2-T16
CDFP4-F16
CDFP4-F16
NA
DESIGNATOR
IH
Errors/Bit/Day
= (0.7)(V
12mA (Min)
5
RAD(Si)
4762
V
Q5
D5
D4
Q4
D3
Q3
CP
CC
CC
2
)
)
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ACS174D Summary of contents
Page 1
... Detailed Electrical Specifications for the ACS174MS are contained in SMD 5962-98634. A “hot-link” is provided on our homepage for downloading. http://www.intersil.com/spacedefense/spaceselect.htm Ordering Information INTERNAL MARKETING ORDERING NUMBER 5962F9863401VCC ACS174DMSR-03 ACS174D/SAMPLE-03 ACS174D/SAMPLE-03 5962F9863401VXC ACS174KMSR-03 ACS174K/SAMPLE-03 ACS174K/SAMPLE-03 5962F9863401V9A ACS174HMSR-03 Pinouts ACS174MS (SBDIP) TOP VIEW ...
Page 2
Die Characteristics DIE DIMENSIONS: Size: 2390 m x 2390 m (94 mils x 94 mils) Thickness: 525 (20.6 mils 1 mil) Bond Pad: 110 m x 110 m (4.3 x 4.3 mils) METALLIZATION: AI Metal 1 Thickness: ...