TS18 SUNTAN [Suntan Capacitors], TS18 Datasheet
TS18
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TS18 Summary of contents
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... MULTILAYER CERAMIC CHIP CAPACITOR - SMD TS18 Dielectris & Values Terminations Voltage Packing Capacitance Tolerance Operating Temperature Range Types of Capacitor and Dielectric Material Suntan Technology Company Limited ® NPO X7R Y5V Z5U consult product pages of catalog for cap ...
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... MULTILAYER CERAMIC CHIP CAPACITOR - SMD TS18 Specification and Test Condition： 1. Appearance Dielectrics No defects or abnormalities NPO/X7R/X5R/Y5V 2. Dimensions Dielectrics Specification Within the specified dimensions NPO/X7R/X5R/Y5V 3. Capacitance Dielectrics Specification Within the specified tolerance NPO B:±0.1pF;C:±0.25pF;D:±0.5pF;J: ±5% Within the specified tolerance X7R/X5R J: ± ...
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... MULTILAYER CERAMIC CHIP CAPACITOR - SMD TS18 5. Insulation Resistance Dielectrics Specification NPO/X7R/ More than 10 GΩ or 500Ω·F, X5R/Y5V whichever is smaller. 6. Dielectric Strength Dielectrics Specification NPO /X7R/X5R/Y5V No defects or abnormalities. 7. Temperature Coefficient of Capacitance Dielectrics Specification Temperature coefficient within NPO ±30ppm/℃ Cp drift within ±0.2% or ±0.05pF X7R/X5R Capacitance change within ± ...
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... MULTILAYER CERAMIC CHIP CAPACITOR - SMD TS18 8. Adhesion Dielectrics Specification NPO No removal of the terminations or X7R/X5R other defect shall occur. Y5V 9. Solderability of Termination Dielectrics Specification NPO 95% min. coverage of both terminal X7R/X5R electrodes and less than 5% have pin Y5V holes or rough spots. 10. Resistance to leaching ...
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... MULTILAYER CERAMIC CHIP CAPACITOR - SMD TS18 11. Bending Dielectrics Specification No remarkable visual damage NPO Cp change ≤ ±5% or ≤ 0.5 pF X7R/X5R No remarkable visual damage Cp change ≤ ±12.5% No remarkable visual damage Y5V Cp change ≤ ±30% 12. Resistance to Soldering Heat Dielectrics Specification No remarkable visual damage NPO Cp change within ±2.5% or ±0.25pF, whichever is larger ...
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... MULTILAYER CERAMIC CHIP CAPACITOR - SMD TS18 13. Temperature Cycle Dielectrics Specification No remarkable visual damage NPO Cp change within ±2.5% or ±0.25pF, whichever is larger. X7R/X5R No remarkable visual damage Cp change within ±7.5% 14. Moisture Resistance ,steady state Dielectrics Specification No remarkable visual damage Cp change within ±5% or ±0.5pF, whichever is larger. Cp< ...
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... MULTILAYER CERAMIC CHIP CAPACITOR - SMD TS18 15. Damp heat with load Dielectrics Specification No remarkable visual damage Cp change≤±7.5% or ±0.75pF, whichever is larger. NPO Cp<30pF, Q≥100+10/3*Cp Cp≥30pF, Q≥200 R*C≥500MΩ or 25Ω·F, whichever is smaller No remarkable visual damage Cp change≤±12.5% X7R/X5R DF:Not more than 2 times of initial value R*C≥ ...
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... MULTILAYER CERAMIC CHIP CAPACITOR - SMD TS18 Packing 1. Tape Packing Paper Tape: Standard taping (8mm paper width) suitable to 0603,0805,4Kpcs/reel To 0402, 10Kpcs/reel. Plastic Tape: Suitable 0805，1206 sizes, for chip thickness over 0.95 mm, 4Kpcs/reel or 3Kpcs/reel are available. 2. Dimensions of Packing Paper： Type 0402 0603 ...
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... MULTILAYER CERAMIC CHIP CAPACITOR - SMD TS18 4. Dimensions of Reel: 5. Taping Figure Suntan Technology Company Limited ® φ180mmReel Website: www.suntan.com.hk Email: info@suntan.com.hk Suntan Tel: (852) 8202 8782 Fax: (852) 8208 6246 ® ...
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... MULTILAYER CERAMIC CHIP CAPACITOR - SMD TS18 6. Taping Method ① Tapes for capacitors are wound clockwise. The sprocket holes are to the right as the tape is pulled toward the user. ② The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches. ...