MC14081BCPG ON Semiconductor, MC14081BCPG Datasheet - Page 12

IC GATE AND QUAD CMOS 14DIP

MC14081BCPG

Manufacturer Part Number
MC14081BCPG
Description
IC GATE AND QUAD CMOS 14DIP
Manufacturer
ON Semiconductor
Series
4000Br
Datasheets

Specifications of MC14081BCPG

Logic Type
AND Gate
Number Of Inputs
2
Number Of Circuits
4
Current - Output High, Low
3.4mA, 3.4mA
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Logic Family
4000
Logical Function
AND
Number Of Elements
4
High Level Output Current
-4.2mA
Low Level Output Current
4.2mA
Propagation Delay Time
100ns
Operating Supply Voltage (typ)
3.3/5/9/12/15V
Operating Temp Range
-55C to 125C
Package Type
PDIP
Number Of Outputs
1
Technology
CMOS
Mounting
Through Hole
Pin Count
14
Operating Temperature Classification
Military
Quiescent Current
1uA
Operating Supply Voltage (max)
18V
Operating Supply Voltage (min)
3V
Product
AND
Supply Voltage (max)
18 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Circuit Type
Low-Power Schottky
Current, Supply
30 μA
Function Type
2-Inputs
Logic Function
AND Gate
Temperature, Operating, Range
-55 to +125 °C
Voltage, Supply
3 to 18 VDC
Output Current
8.8mA
No. Of Inputs
2
Supply Voltage Range
3V To 18V
Logic Case Style
DIP
No. Of Pins
14
Operating Temperature Range
-55°C To +125°C
Filter Terminals
DIP
Rohs Compliant
Yes
Family Type
4000 CMOS
Dc
08+
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC14081BCPGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC14081BCPG
Manufacturer:
ON Semiconductor
Quantity:
135
Part Number:
MC14081BCPG
Manufacturer:
ON/安森美
Quantity:
20 000
SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
0.58
T
14X
K
B
S
C
P
7 PL
A
SOLDERING FOOTPRINT*
S
0.25 (0.010)
PACKAGE DIMENSIONS
R
http://onsemi.com
1
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE H
M
7.04
7X
B
12
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_

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