MC14011BCPG ON Semiconductor, MC14011BCPG Datasheet - Page 12

IC GATE NAND QUAD 2INPUT 14DIP

MC14011BCPG

Manufacturer Part Number
MC14011BCPG
Description
IC GATE NAND QUAD 2INPUT 14DIP
Manufacturer
ON Semiconductor
Series
4000Br
Datasheets

Specifications of MC14011BCPG

Logic Type
NAND Gate
Number Of Inputs
2
Number Of Circuits
4
Current - Output High, Low
3.4mA, 3.4mA
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Logic Family
4000
Logical Function
NAND
Number Of Elements
4
High Level Output Current
-4.2mA
Low Level Output Current
4.2mA
Propagation Delay Time
80ns
Operating Supply Voltage (typ)
3.3/5/9/12/15V
Operating Temp Range
-55C to 125C
Package Type
PDIP
Number Of Outputs
1
Technology
CMOS
Mounting
Through Hole
Pin Count
14
Operating Temperature Classification
Military
Quiescent Current
1uA
Operating Supply Voltage (max)
18V
Operating Supply Voltage (min)
3V
Product
NAND
Supply Voltage (max)
18 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Circuit Type
Low-Power Schottky
Current, Supply
30 μA
Function Type
2-Inputs
Logic Function
NAND Gate
Temperature, Operating, Range
-55 to +125 °C
Voltage, Supply
3 to 18 VDC
Output Current
8.8mA
No. Of Inputs
2
Supply Voltage Range
3V To 18V
Logic Case Style
DIP
No. Of Pins
14
Operating Temperature Range
-55°C To +125°C
Filter Terminals
DIP
Rohs Compliant
Yes
Family Type
4000 CMOS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC14011BCPGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC14011BCPG
Manufacturer:
ON
Quantity:
2 145
Part Number:
MC14011BCPG
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
MC14011BCPG
Quantity:
645
SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
0.58
T
14X
K
B
S
C
P
7 PL
A
SOLDERING FOOTPRINT*
S
0.25 (0.010)
PACKAGE DIMENSIONS
R
http://onsemi.com
1
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE H
M
7.04
7X
B
12
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_

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