cspesd302 California Micro Devices Corporation, cspesd302 Datasheet

cspesd302

Manufacturer Part Number

cspesd302

Description

1,2 And 3-channel Esd Arrays In Csp

Manufacturer

California Micro Devices Corporation

Datasheet

1.CSPESD302.pdf (7 pages)

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12/10/03

Features

•

Applications

•

Electrical Schematics

Cellphones, notebook computers, PDAs

Wireless Handsets

MP3 Players

Digital Still Cameras

Handheld PCs

1, 2 or 3 channels of ESD protection

±15kV ESD protection (IEC 61000-4-2, contact

discharge)

±30kV ESD protection (HBM)

Supports both AC and DC signal applications

Low leakage current (<100nA)

Chip Scale Package features extremely low lead

inductance for optimum ESD and filter perfor-

mance

4 bump, 1.06 x 0.93mm footprint Chip Scale Pack-

age (CSP)

Lead-free version available

I/O port protection

EMI filtering for data ports

430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214

CSPESD301

1,2 and 3-Channel ESD Arrays in CSP

CSPESD302

Product Description

The CSPESD301/302/303 is a family of 1, 2, and 3-

channel ESD protection arrays, which integrate two,

three and four identical avalanche-style diodes. It is

intended that one of these diodes is connected to GND

and the other diodes provide ESD protection for up to 3

lines depending upon the configuration utilized. The

back-to-back diode connections provide ESD protec-

tion for nodes that have AC signals up to 5.9V peak.

These devices provide a very high level of protection

for sensitive electronic components that may be sub-

jected to electrostatic discharge (ESD). The diodes

are designed and characterized to safely dissipate

ESD strikes of ±15kV, well beyond the maximum

requirements of the IEC 61000-4-2 international stan-

dard. Using the MIL-STD-883 (Method 3015) specifica-

tion for Human Body Model (HBM) ESD, these devices

protection against contact discharges at greater than

±30kV. The diodes also provide some EMI filtering,

when used in combination with a PCB trace or series

resistor.

These devices are particularly well suited for portable

electronics (e.g. cellular telephones, PDAs, notebook

computers) because of their small package format and

easy-to-use pin assignments.

The CSPESD301/2/3 is available in a space-saving,

low-profile, chip-scale package with optional lead-free

finishing.

L Fax: 408.263.7846

CSPESD301/302/303

CSPESD303

www.calmicro.com

Related parts for cspesd302

cspesd302 Summary of contents

Page 1

... These devices are particularly well suited for portable electronics (e.g. cellular telephones, PDAs, notebook computers) because of their small package format and easy-to-use pin assignments. The CSPESD301/2/3 is available in a space-saving, low-profile, chip-scale package with optional lead-free finishing CSPESD302 L Fax: 408.263.7846 CSPESD301/302/303 CSPESD303 L www.calmicro.com ...

Page 2

... Standard Finish Ordering Part 1 Number Part Marking CSPESD301 F CSPESD302 G CSPESD303 H + " character for the top side orientation mark. CSPESD301/302/303 BOTTOM VIEW (Bumps Up View Orientation Marking B2 B1 Lead-free Finish Ordering Part 1 Number CSPESD301G CSPESD302G CSPESD303G L Fax: 408.263.7846 L www.calmicro.com 2 Part Marking 12/10/03 ...

Page 3

Specifications PARAMETER Storage Temperature Range DC Package Power Rating PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER V Diode Stand-off Voltage SO I Diode Leakage Current LEAK V Small Signal Clamp Voltage SIG Positive Clamp Negative Clamp V In-system ...

Page 4

Performance Information Figure 2. Typical EMI Filter Performance (0VDC, 50 Ohm Environment) Figure 3. Typical Capacitance VS. Input Voltage (normalized to 0Vdc) © 2003 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L ...

Page 5

Performance Information (cont’d) 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -12 -11 - © 2003 California Micro Devices Corp. All rights reserved. 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 12/10/03 I (µ ...

Page 6

Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening ...

Page 7

... Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) CSPESD301 1.06 X 0.93 X 0.6 CSPESD302 CSPESD303 Top Cover Tape For tape feeder reference only including draft. Concentric around B. © 2003 California Micro Devices Corp. All rights reserved. ...

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