M74VHC1GT14DTT1G ON Semiconductor, M74VHC1GT14DTT1G Datasheet - Page 6

• Manufacturer Part Number: M74VHC1GT14DTT1G
• Description: IC INVERT SGL SCHMTT TTL SOT23-5
• Manufacturer: ON Semiconductor
• Series: 74VHCr

Specifications of M74VHC1GT14DTT1G

• Logic Type: Inverter with Schmitt Trigger
• Number Of Inputs: 1
• Number Of Circuits: 1
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TSOT-23-5, TSOT-5, TSOP-5
• Logical Function: Inverter Schmit Trig
• Logic Family: VHC
• Number Of Elements: 1
• Input Type: Schmitt Trigger
• High Level Output Current: -8mA
• Low Level Output Current: 8mA
• Propagation Delay Time: 20.5ns
• Operating Supply Voltage (typ): 3.3/5V
• Package Type: TSOP
• Operating Temp Range: -55C to 125C
• Pin Count: 5
• Quiescent Current: 1uA
• Output Type: Schmitt Trigger
• Technology: CMOS
• Mounting: Surface Mount
• Operating Temperature Classification: Military
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 3V
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 3 V to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: M74VHC1GT14DTT1GOS; M74VHC1GT14DTT1GOS; M74VHC1GT14DTT1GOSTR; MC74VHC1GT14DTT1G; MC74VHC1GT14DTT1GOS; MC74VHC1GT14DTT1GOS

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
1.0
C A B
0.037
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
MC74VHC1GT14
http://onsemi.com
J
CASE 483−02
K
ISSUE G
TSOP−5
0.074
1.9
DETAIL Z
6
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
M
A
B
C
D
G
H
K
S
J
L
mm
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_
MC74VHC1GT14/D