B140HB_1

Manufacturer Part NumberB140HB_1
Description1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
ManufacturerDIODES [Diodes Incorporated]
B140HB_1 datasheet
 
1
Page 1
2
Page 2
3
Page 3
Page 1/3

Download datasheet (445Kb)Embed
Next
Features
Low Leakage Current
Guard Ring Die Construction for
Transient Protection
Ideally Suited for Automatic Assembly
Low Power Loss, High Efficiency
Surge Overload Rating to 45A Peak
Lead Free/RoHS Compliant (Note 3)
Mechanical Data
Case: SMB
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208
Marking Informaton: See page 3
Ordering Information: See page 3
Polarity: Cathode Band or Cathode Notch
Weight: 0.093 grams (approximate)
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on rated load
Non-Repetitive Peak Forward Surge Current
5 s Single half sine-wave
Forward Voltage
@ I
= 1.0A, @ T
F
@ I
= 2.0A, @ T
F
@ I
= 1.0A, @ T
F
@ I
= 2.0A, @ T
F
Peak Reverse Current
at Rated DC Blocking Voltage
Typical Total Capacitance (Note 2)
Typical Thermal Resistance Junction to Terminal (Note 1)
Operating and Storage Temperature Range
Notes:
1. Thermal Resistance: Junction to terminal, unit mounted on PC board with 5.0 mm
2. Measured at 1.0MHz and applied reverse voltage of 5.0V DC.
3. RoHS revision 13.2.2003. High Temperature Solder Exemption Applied, see EU Directive Annex Note 7.
DS30128 Rev. 8 - 2
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
B
A
J
G
H
E
e
3
@ T
= 25 C unless otherwise specified
A
Symbol
V
RRM
V
RWM
@ I
= 0.1mA
V
R
R
V
R(RMS)
@ T
= 115 C
I
T
O
I
FSM
I
FSM
= 25 C
j
= 25 C
j
V
FM
= 125 C
j
= 125 C
j
@ T
= 25 C
A
I
RM
@ T
= 125 C
A
C
T
R
JT
T
T
j,
STG
2
(0.013 mm thick) copper pads as heat sink.
1 of 3
www.diodes.com
SPICE MODEL: B140HB
B140HB
SMB
Dim
Min
Max
3.30
3.94
A
C
B
4.06
4.57
C
1.96
2.21
D
0.15
0.31
D
5.00
5.59
E
G
0.10
0.20
H
0.76
1.52
2.00
2.62
J
All Dimensions in mm
Value
Unit
40
V
28
V
1.0
A
45
A
430
A
0.53
0.70
V
0.49
0.64
0.1
mA
4.0
80
pF
36
C/W
-55 to +150
C
B140HB
Diodes Incorporated

B140HB_1 Summary of contents

  • Page 1

    Features Low Leakage Current Guard Ring Die Construction for Transient Protection Ideally Suited for Automatic Assembly Low Power Loss, High Efficiency Surge Overload Rating to 45A Peak Lead Free/RoHS Compliant (Note 3) Mechanical Data Case: SMB Case Material: Molded Plastic. ...

  • Page 2

    T , TERMINAL TEMPERATURE (ºC) T Fig. 1 Forward Current Derating Curve 150ºC j Single Half Sine-Wave NUMBER OF CYCLES AT ...

  • Page 3

    ... Device B140HB-13-F Notes: 4. For Packaging Details our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information B140HB Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others ...