74F646B NSC [National Semiconductor], 74F646B Datasheet

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74F646B

Manufacturer Part Number
74F646B
Description
Octal Transceiver/Register with TRI-STATE Outputs
Manufacturer
NSC [National Semiconductor]
Datasheet
C 1995 National Semiconductor Corporation
54F 74F646 74F646B 54F 74F648
Octal Transceiver Register with TRI-STATE Outputs
General Description
These devices consist of bus transceiver circuits with TRI-
STATE D-type flip-flops and control circuitry arranged for
multiplexed transmission of data directly from the input bus
or from the internal registers Data on the A or B bus will be
clocked into the registers as the appropriate clock pin goes
to a high logic level Control G and direction pins are provid-
ed to control the transceiver function In the transceiver
mode data present at the high impedance port may be
stored in either the A or the B register or in both The select
controls can multiplex stored and real-time (transparent
mode) data The direction control determines which bus will
receive data when the enable control G is Active LOW In
the isolation mode (control G HIGH) A data may be stored
in the B register and or B data may be stored in the A regis-
ter
Logic Symbols
TRI-STATE is a registered trademark of National Semiconductor Corporation
Note 1 Devices also available in 13 reel Use suffix
Note 2 Military grade device with environmental and burn-in processing Use suffix
74F646SPC
74F646SC (Note 1)
74F646MSA (Note 1)
74F646BSPC
74F646BSC (Note 1)
74F648SPC
74F648SC (Note 1)
Commercial
’F646 ’F646B
54F646DM (Note 2)
54F646FM (Note 2)
54F646LM (Note 2)
54F648SDM (Note 2)
54F648FM (Note 2)
54F648LM (Note 2)
TL F 9580
Military
e
SCX
TL F 9580 – 1
N24C
J24F
M24B
MSA24
W24C
E28A
N24C
M24B
N24C
J24F
M24B
W24C
E28A
Package
Number
Features
Y
Y
Y
Y
Y
Y
Y
Y
Independent registers for A and B buses
Multiplexed real-time and stored data
’F648 has inverting data paths
’F646 ’F646B have non-inverting data paths
’F646B is a faster version of the ’F646
TRI-STATE outputs
300 mil slim DIP
Guaranteed 4000V minimum ESD protection
24-Lead (0 300 Wide) Molded Dual-In-Line
24-Lead (0 300 Wide) Ceramic Dual-In-Line
24-Lead (0 300 Wide) Molded Small Outline JEDEC
24-Lead Molded Shrink Small Outline EIAJ Type II
24-Lead Cerpack
28-Lead Ceramic Leadless Chip Carrier Type C
24-Lead (0 300 Wide) Molded Dual-In-Line
24-Lead (0 300 Wide) Molded Small Outline JEDEC
24-Lead (0 300 Wide) Molded Dual-In-Line
24-Lead (0 300 Wide) Ceramic Dual-In-Line
24-Lead (0 300 Wide) Molded Small Outline JEDEC
24-Lead Cerpack
24-Lead Ceramic Leadless Chip Carrier Type C
e
DMQB FMQB and LMQB
Package Description
’F648
RRD-B30M75 Printed in U S A
December 1994
TL F 9580– 7

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74F646B Summary of contents

Page 1

... Octal Transceiver Register with TRI-STATE Outputs General Description These devices consist of bus transceiver circuits with TRI- STATE D-type flip-flops and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers Data on the bus will be ...

Page 2

Logic Symbols (Continued) IEEE IEC ’F646 ’F646B Connection Diagrams Pin Assignment for DIP SOIC and Flatpak ’F646 ’F646B Pin Assignment for LCC ’F646 ’F646B IEEE IEC TL F 9580–4 Pin Assignment for DIP SOIC and Flatpak TL F 9580–2 Pin ...

Page 3

Unit Loading Fan Out Pin Names Description HIGH LOW A –A Data Register A Inputs 0 7 TRI-STATE Outputs 600 106 6 (80) B –B Data Register B Inputs 0 7 TRI-STATE Outputs 600 106 6 (80) CPAB CPBA Clock ...

Page 4

Logic Diagrams (Continued) Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays ’F646 ’F646B 9580– 5 ...

Page 5

Logic Diagrams (Continued) Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays ’F648 9580 – 6 ...

Page 6

Absolute Maximum Ratings If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature b Ambient Temperature under Bias b Junction Temperature under Bias b Plastic b V Pin Potential ...

Page 7

AC Electrical Characteristics Symbol Parameter f Maximum Clock Frequency max t Propagation Delay PLH t Clock to Bus PHL t Propagation Delay PLH t Bus to Bus (’F646) PHL t Propagation Delay PLH t Bus to Bus (’F648) ...

Page 8

AC Electrical Characteristics Symbol Parameter f Maximum Clock Frequency max t Propagation Delay PLH t Clock to Bus PHL t Propagation Delay PLH t Bus to Bus PHL t Propagation Delay PLH t SBA or SAB ...

Page 9

Physical Dimensions inches (millimeters) 28-Lead Ceramic Leadless Chip Carrier Type C 24-Lead (0 300 Wide) Ceramic Dual-In-Line Package (SD) NS Package Number E28A NS Package Number J24F 9 ...

Page 10

Physical Dimensions inches (millimeters) (Continued) 24-Lead (0 300 Wide) Molded Small Outline Package JEDEC (S) NS Package Number M24B 10 ...

Page 11

Physical Dimensions inches (millimeters) (Continued) 24-Lead Molded Shrink Small Outline Package EIAJ Type II 24-Lead (0 300 Wide) Molded Dual-In-Line Package (SP) NS Package Number MSA24 NS Package Number N24C 11 ...

Page 12

Physical Dimensions inches (millimeters) (Continued) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 ...

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