IRF7530PBF IRF [International Rectifier], IRF7530PBF Datasheet

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IRF7530PBF

Manufacturer Part Number
IRF7530PBF
Description
HEXFET Power MOSFET
Manufacturer
IRF [International Rectifier]
Datasheet
Description
Thermal Resistance
l
l
l
l
l
l
l
New trench HEXFET
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design that HEXFET
Power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a wide
variety of applications.
The new Micro8™ package has half the footprint area of the
standard SO-8. This makes the Micro8 an ideal device for
applications where printed circuit board space is at a premium.
The low profile (<1.1mm) of the Micro8 will allow it to fit easily
into extremely thin application environments such as portable
electronics and PCMCIA cards.
www.irf.com
V
I
I
I
P
P
E
V
T
R
Available in Tape & Reel
D
D
DM
Lead-Free
Trench Technology
J,
Dual N-Channel MOSFET
Low Profile (<1.1mm)
DS
D
D
AS
GS
Ultra Low On-Resistance
Very Small SOIC Package
θJA
@ T
@ T
@T
@T
T
STG
A
A
A
A
= 70°C
= 25°C
= 25°C
= 70°C
Drain- Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation
Power Dissipation
Linear Derating Factor
Single Pulse Avalanche Energy„
Gate-to-Source Voltage
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
®
power MOSFETs from International
Parameter
Parameter
GS
GS
ƒ
@ 4.5V
@ 4.5V
G2
G1
S2
S1
1
2
3
4
Top View
HEXFET
8
7
6
5
-55 to + 150
Max.
Max.
100
0.80
± 12
D1
5.4
4.3
1.3
D1
D2
D2
20
40
10
33
Micro8™
®
R
DS(on)
Power MOSFET
V
DSS
= 0.030Ω
= 20V
PD - 95243
mW/°C
Units
Units
°C/W
5/13/04
mJ
°C
V
A
V
1

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IRF7530PBF Summary of contents

Page 1

Trench Technology l Ultra Low On-Resistance l Dual N-Channel MOSFET l Very Small SOIC Package l Low Profile (<1.1mm) l Available in Tape & Reel l Lead-Free l Description ® New trench HEXFET power MOSFETs from International Rectifier utilize advanced ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS ∆V Breakdown Voltage Temp. Coefficient /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage ...

Page 3

VGS TOP 7.00V 5.00V 4.50V 3.50V 3.00V 2.70V 2.50V BOTTOM 2.25V 2.25V 20µs PULSE WIDTH 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 100 ...

Page 4

1MHz iss rss 1600 oss iss 1200 800 400 C oss C ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 1000 100 D = 0.50 0.20 0.10 10 0.05 0.02 0.01 1 SINGLE PULSE (THERMAL ...

Page 6

Id = 5.0A 0.02 0.01 2.0 3.0 4.0 5.0 V GS, Gate -to -Source Voltage ( V ) Fig 12. On-Resistance Vs. Gate Voltage 6 0.10 0.08 0.06 0.04 0. 6.0 7.0 I Fig 13. On-Resistance ...

Page 7

Micro8 Package Outline Dimensions are shown in milimeters (inches 0.25 (.010 ...

Page 8

Micro8 Tape & Reel Information Dimensions are shown in millimeters (inches) TERMINAL NUMBER 1 8.1 ( .318 ) 7.9 ( .312 ) NOTES: 1. OUTLINE CONFORMS TO EIA-481 & EIA-541. 2. CONTROLLING DIMENSION : MILLIMETER. 330.00 (12.992) MAX. NOTES : ...

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