FSMD030-2920 RFE [RFE international], FSMD030-2920 Datasheet - Page 2

• Manufacturer Part Number: FSMD030-2920
• Description: Surface Mount PPTC FSMD2920 Series
• Manufacturer: RFE [RFE international]

THERMAL DERATING CURVE
TYPICAL TIME-TO-TRIP AT 23°C
PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS
Solder Reflow
Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned by using standard industry methods and solvents.
5. Storage Environment: <30°C / 60%RH
Caution:
If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.
Rework:
Use standard industry practices.
The dimension in the table below provide the recommended pad layout for each FSMD2920 device
NOTE: All Specification subject to change without notice.
NOMINAL PAD DIMENSIONS (MILLIMETERS)
2.3
RFE International • Tel:[phone] • Fax:[phone] • E-Mail [e-mail]
5.1
2.3
Surface Mount PPTC
FSMD2920 Series
0.001
0.01
100
0.1
10
1
200%
150%
100%
0.1
50%
0%
-40
5.6
-20
A
Thermal Derating Curve, FSMD Series
B C
0
1
Ambient Temperature (C)
Fault current (A)
D EFGHI
Solder Reflow
20
260 °C
217 °C
f
200 °C
150 °C
25 °C
40
10
60
60 to 180 Seconds
Preheat
A
B
80
100
3°C/Second Max
Ramp-up
A= FSMD125 ~ FSMD260
B= FSMD030 ~ FSMD100
G = FSMD185-2920
A = FSMD030-2920
B = FSMD050-2920
C = FSMD075-2920
D = FSMD100-2920
E = FSMD125-2920
F = FSMD150-2920
H = FSMD200-2920
J = FSMD260-2920
I = FSMD250-2920
20 to 40 Seconds
60 to 150 Seconds
6°C/Second Max
Ramp-down
C5ED04
REV 2007.8.14
RoHS