v23079-g2016-b301 Tyco Electronics, v23079-g2016-b301 Datasheet - Page 12

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v23079-g2016-b301

Manufacturer Part Number
v23079-g2016-b301
Description
Telecom-, Signal And Rf Relays
Manufacturer
Tyco Electronics
Datasheet
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Recommended Soldering Conditions
Recommended reflow soldering profile
Resistance to soldering heat - Reflow profile
240 °C
180 °C
130 °C
100 °C
Time (s)
Time (s)
Time (s)
20 - 40 sec
AXICOM
Telecom-, Signal and RF Relays
P2 V23079 Relay
Full line:
Dotted line: process limits
forced
cooling
typical
Vapor Phase Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
108-98002 Rev. F
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