am55-0004 Tyco Electronics, am55-0004 Datasheet - Page 6

• Manufacturer Part Number: am55-0004
• Description: Linear Power Amplifier Switch
• Manufacturer: Tyco Electronics

Recommended PCB Configuration
External Circuitry Parts List
Specifications Subject to Change Without Notice
M/A-COM Inc.
All off-chip components are low-cost surface mount components obtainable from
multiple sources. (0.020 in. x 0.040 in. or 0.030 in. x 0.050 in.)
External Circuitry
0.490 in.
ANT IN/OUT
C1 - C5
C6 - C8
C9
C10
R1
R2
R3
Tline
Label
Save Tx
Rx OUT
VSW
Tx IN
V
C8
DD1
C5
1000 pF
68 pF
1.5 pF
15 pF
2.7 k Ω
1.5 k Ω
150 Ω
0.250 in. long
Pin 1
C4
Value
C8
Layout View
0.700 in.
C4
1011 Pawtucket Boulevard, Lowell, MA 01853 USA
C5
Low frequency bypass
RF bypass
Output power tuning
Reduces low frequency gain
Voltage divider to V
Voltage divider to V
Reduces low frequency gain
Power match
C1
C10
C3
R3
Purpose
C6
C2
C7
R2
C9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
G2
G2
R1
6
28
27
26
25
24
23
22
21
20
19
18
17
16
15
The PCB dielectric between RF traces and RF ground layers
should be chosen to reduce RF discontinuities between
50-Ω lines and package pins. M/A-COM recommends an
FR-4 dielectric thickness of 0.008 in. (0.2 mm), yielding a
50-Ω line width of 0.015 in. (0.38 mm). The recommended
metalization thickness is 1 oz. copper.
Shaded traces are vias to DC routing layer and traces on DC
routing layer.
Biasing Procedure
The AM55-0004 requires that V
any V
procedure is not followed. All FETs in the PA will draw
excessive current and damage internal circuitry.
DD
bias. Permanent damage may occur if this
C10
R3
TLine
Cross-Section View
C3
C2
C1
C9
C7
GG
DC Routing
Customer Defined
RF Traces + Components
RF Ground
R2
C6
bias be applied prior to
Telephone: [phone]
R1
VSW
V
PA IN
V
PA OUT
V
G1
DD2
G2
V 2.00