DS1091LUA+027 MAXIM [Maxim Integrated Products], DS1091LUA+027 Datasheet - Page 6

• Manufacturer Part Number: DS1091LUA+027
• Description: Automotive Temperature Range Spread-Spectrum Econoscillator
• Manufacturer: MAXIM [Maxim Integrated Products]

Upon the application of power, the DS1091L output is
held in the low state until t
removes any possibility of erroneous output transitions
during initial power-up.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
6 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2006 Maxim Integrated Products
Automotive Temperature Range
Spread-Spectrum Econoscillator
Figure 1A. Center Dithered
Figure 1B. Down Dithered
Springer
DS1091L Frequency Spreading Profile as a
(2%, 4%, OR 8% OF f
(1%, 2%, OR 4% OF f
(1%, 2%, OR 4% OF f
PROGRAMMED f
PROGRAMMED f
PROGRAMMED f
PROGRAMMED f
PROGRAMMED f
is a registered trademark of Dallas Semiconductor Corporation.
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
+
-
-
)
)
)
DITHER FREQ
DITHER FREQ
1
1
Function of Dither %
TIME
TIME
PU
IF DITHER AMOUNT = 0%
IF DITHER AMOUNT = 0%
has elapsed. This
Power-Up
DITHER
AMOUNT
(-2%, -4%,
OR -8%)
DITHER
AMOUNT
(±1%, ±2%,
OR ±4%)
To achieve best results, it is highly recommended that
decoupling capacitors are used on the IC power-supply
pins. Typical values of decoupling capacitors are 0.01µF
and 0.1µF. Use a high-quality, ceramic, surface-mount
capacitor, and mount it as close as possible to the V
and GND pins of the IC to minimize lead inductance.
Email [e-mail] for
information/questions concerning custom frequencies.
TRANSISTOR COUNT: 4887
SUBSTRATE CONNECTED TO GROUND
For the latest package outline information, go to
www.maxim-ic.com/DallasPackInfo.
is a registered trademark of Maxim Integrated Products, Inc.
Requesting Custom Frequencies
Application Information
Package Information
Power-Supply Decoupling
Chip Topology
CC