apm4568ak Anpec Electronics Corporation, apm4568ak Datasheet - Page 13

• Manufacturer Part Number: apm4568ak
• Description: Dual Enhancement Mode Mosfet N- And P-channel
• Manufacturer: Anpec Electronics Corporation

APM4568AK
Classification Reflow Profiles
Customer Service
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright
Rev. A.2 - Dec., 2008
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Table 2. Pb-free Process – Package Classification Reflow Temperatures
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the
Average ramp-up rate
(T
Preheat
Time maintained above:
Peak/Classification Temperature (Tp)
Time within 5 C of actual
Peak Temperature (tp)
Ramp-down Rate
Time 25 C to Peak Temperature
stated classification temperature (this means Peak reflow temperature +0 C. For example 260 C+0 C)
at the rated MSL level.
L
Package Thickness
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
- Temperature (T
- Time (t
to T
1.6 mm – 2.5 mm
P
<1.6 mm
)
Package Thickness
2.5 mm
Anpec Electronics Corp.
Head Office :
Taipei Branch :
L
Profile Feature
ANPEC Electronics Corp.
)
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : [phone]
Fax : [phone]
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindain City, Taipei County 23146, Taiwan
Tel : [phone]
Fax : [phone]
<2.5 mm
2.5 mm
L
)
Volume mm
260 +0 C*
260 +0 C*
250 +0 C*
<350
Sn-Pb Eutectic Assembly
3
3 C/second max.
6 C/second max.
60-120 seconds
60-150 seconds
6 minutes max.
10-30 seconds
Volume mm
240 +0/-5 C
225 +0/-5 C
See table 1
13
100 C
150 C
183 C
<350
Volume mm
260 +0 C*
250 +0 C*
245 +0 C*
350-2000
3
3
Pb-Free Assembly
3 C/second max.
6 C/second max.
60-180 seconds
60-150 seconds
8 minutes max.
20-40 seconds
Volume mm
225 +0/-5 C
225 +0/-5 C
See table 2
Volume mm
150 C
200 C
217 C
260 +0 C*
245 +0 C*
245 +0 C*
350
www.anpec.com.tw
>2000
3
3