bl-hgk33-av-trb BRIGHT LED ELECTRONICS CORP, bl-hgk33-av-trb Datasheet
bl-hgk33-av-trb
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bl-hgk33-av-trb Summary of contents
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... SINCE 1981 ●DEVICE NUMBER：BL-HGK33-AV-TRB SHEET DATE 2009.04.13 1.0 1.0 1.0 1.0 1.0 1.0 1.0 佰鴻工業股份有限公司 佰鴻工業股份有限公司 BRIGHT LED ELECTRONICS CORP. 台北縣板橋市和平路 19 號 3 樓 ...
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... Features: 1. Emitted Color : Green 2. Lens Appearance : Water Clear. 3. Mono-color type. 4. 3.2x1.6x1.1mm(1206) standard package. 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn’t contain restriction Substance, comply ROHS standard. ...
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SINCE 1981 ● Electrical and optical characteristics(Ta=25℃) Parameter Forward Voltage Luminous Intensity Reverse Current Peak Wave Length Dominant Wave Length Spectral Line Half-width Viewing Angle ● Typical Electro-Optical Characteristics Curves Fig.1 Relative ...
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SINCE 1981 ● Tapping and packaging specifications(Units: mm) USER DIRECTION OF FEED 1.88± 0.1 START 4.0 ± 0.1 4.0 ± 0.1 ● Package Method:(unit:mm) Vacuum 3000 pcs/reel Bar Code Label 220 佰鴻工業股份有限公司 ...
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SINCE 1981 ● Bin Limits ...
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SINCE 1981 ● Reliability Test Classification Test Item Operation Life MIL-STD-750:1026 High Temperature High Humidity Endurance Storage Test High Temperature Storage Low Temperature Storage Temperature Cycling Thermal Shock MIL-STD-202:107D Environmental Test Solder ...
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... Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. http://www.brtled.com Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook ...
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... BRIGHT LEDs. ● Storage: In order to avoid the absorption of moisture recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a ...