sfc2280-68 Semtech Corporation, sfc2280-68 Datasheet - Page 4

• Manufacturer Part Number: sfc2280-68
• Description: Sfc2280-68 Chipclamp? Headset Microphone Emi Filter And Esd Protection
• Manufacturer: Semtech Corporation

Device Connection Options
The SFC2280-68 has solder bumps located in a 3 x 2
matrix layout on the active side of the device. The
bumps are designated by the numbers 1 - 3 along the
horizontal axis and letters A - B along the vertical axis.
The lines to be protected are connected at bumps A1,
B1, A3, and B3. Bumps A2 and B2 are connected to
ground. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces.
Flip Chip TVS
Flip chip TVS devices are wafer level chip scale pack-
ages. They eliminate external plastic packages and
leads and thus result in a significant board space
savings. Manufacturing costs are minimized since they
do not require an intermediate level interconnect or
interposer layer for reliable operation. They are com-
patible with current pick and place equipment further
reducing manufacturing costs. Certain precautions
and design considerations have to be observed how-
ever for maximum solder joint reliability. These include
solder pad definition, board finish and assembly
parameters.
Printed Circuit Board Mounting
Non-solder mask defined (NSMD) land patterns are
recommended for mounting the SFC2280-68. Solder
mask defined (SMD) pads produce stress points near
the solder mask on the PCB side that can result in
solder joint cracking when exposed to extreme fatigue
conditions. The recommended pad size is 0.225 ±
0.010 mm with a solder mask opening of 0.350 ±
0.025 mm.
Grid Courtyard
The recommended grid placement courtyard is 1.3 x
1.8 mm. The grid courtyard is intended to encompass
the land pattern and the component body that is
centered in the land pattern. When placing parts on a
PCB, the highest recommended density is when one
courtyard touches another.
PROTECTION PRODUCTS
Applications Information
2004 Semtech Corp.
4
Pin Identification and Configuration (Bottom View)
P
A
B
A
B
A
B
To Protected IC
n i
1
3
2
1
3
2
B
A
1
Layout Example
To Connector
L
L
L
L
Ground
n i
n i
n i
n i
e
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2
1
1
2
2
d I
n I
O
n I
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SFC2280-68
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