C1206C103B1GA KEMET [Kemet Corporation], C1206C103B1GA Datasheet

C1206C103B1GA

Manufacturer Part Number

C1206C103B1GA

Description

CERAMIC CHIP CAPACITORS

Manufacturer

KEMET [Kemet Corporation]

Datasheet

1.C1206C103B1GA.pdf (8 pages)

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* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)

+ For extended value 1210 case size - solder reflow only.

CERAMIC

SIZE CODE

SPECIFICATION

C - Standard

CAPACITANCE CODE

Expressed in Picofarads (pF)

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)

(Example: 2.2pF = 229 or 0.50 pF = 508)

CAPACITANCE TOLERANCE

B – ±0.10pF

C – ±0.25pF

D – ±0.5pF

F – ±1%

G – ±2%

• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics

• 10, 16, 25, 50, 100 and 200 Volts

• Standard End Metalization: Tin-plate over nickel

• Available Capacitance Tolerances: ±0.10 pF; ±0.25

SIZE CODE

EIA SIZE

CODE

0201*

0402*

0805*

1206*

1210*

1825*

barrier

pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

+80%-20%

0603

1812

2220

2225

0402*

0603*

0805*

1206*

1210*

1825*

1812

2220

2225

EIA

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

SIZE CODE

METRIC

(Ref only)

METRIC

0603

1005

1608

2012

3216

3225

4532

4564

5650

5664

1005

1608

2012

3216

3225

4532

4564

5650

5664

J – ±5%

K – ±10%

M – ±20%

P – (GMV) – special order only

Z – +80%, -20%

0.6 (.024) ± .03 (.001)

1.6 (.063) ± .15 (.006)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .20 (.008)

4.5 (.177) ± .30 (.012)

5.6 (.220) ± .40 (.016)

1.0 (.04) ± .05 (.002)

CAPACITOR ORDERING INFORMATION

DIMENSIONS—MILLIMETERS AND (INCHES)

L - LENGTH

CERAMIC CHIP CAPACITORS

* Part Number Example: C0805C103K5RAC

C 0805 C 103 K 5 R A C*

CAPACITOR OUTLINE DRAWINGS

0.3 ± (.012) ± .03 (.001)

1.25 (.049) ± .20 (.008)

0.8 (.032) ± .15 (.006)

1.6 (.063) ± .20 (.008)

2.5 (.098) ± .20 (.008)

3.2 (.126) ± .30 (.012)

6.4 (.252) ± .40 (.016)

5.0 (.197) ± .40 (.016)

6.3 (.248) ± .40 (.016)

0.5 (.02) ± .05 (.002)

W - WIDTH

FEATURES

for thickness

THICKNESS

See page 78

dimensions.

ELECTRODES

• Tape and reel packaging per EIA481-1. (See page

• RoHS Compliant

92 for specific tape and reel information.) Bulk

Cassette packaging (0402, 0603, 0805 only) per

IEC60286-6 and EIAJ 7201.

(14 digits - no spaces)

0.15 (.006) ± .05 (.002)

0.35 (.014) ± .15 (.006)

0.60 (.024) ± .35 (.014)

0.20 (.008) -.40 (.016)

0.50 (.02) ± .25 (.010)

B - BANDWIDTH

METALLIZATION

TEMPERATURE CHARACTERISTIC

CONDUCTIVE

C-Standard (Tin-plated nickel barrier)

TIN PLATE

G – C0G (NP0) (±30 PPM/°C)

R – X7R (±15%) (-55°C + 125°C)

P– X5R (±15%) (-55°C + 85°C)

U – Z5U (+22%, -56%) (+10°C + 85°C)

V – Y5V (+22%, -82%) (-30°C + 85°C)

Change Over Temperature Range

(Standard Chips - For

Military see page 87)

SEPARATION

NICKEL PLATE

0.75 (.030)

minimum

0.3 (.012)

0.7 (.028)

Designated by Capacitance

FAILURE RATE LEVEL

VOLTAGE

1 - 100V

2 - 200V

5 - 50V

7 - 4V

N/A

END METALLIZATION

A- Not Applicable

Solder Wave +

Solder Reflow

TECHNIQUE

MOUNTING

3 - 25V

4 - 16V

8 - 10V

9 - 6.3V

Solder

Reflow

Related parts for C1206C103B1GA

C1206C103B1GA Summary of contents

Page 1

CERAMIC CHIP CAPACITORS • C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ...

Page 2

CERAMIC CHIP/STANDARD 0201 Cap Cap Cap pF Code Tolerance 6.3V 16V 6.3V 10,000 103 K,M AA~ 12,000 123 K,M BB 15,000 153 K,M BB 18,000 183 K,M BB 22,000 223 K,M BB 27,000 273 K,M BB 33,000 333 K,M BB ...

Page 3

CERAMIC CHIP CAPACITORS Packaging Quantity Based on Finished Chip Thickness Specifications Thickness Chip Chip Thickness Code Size Range (mm) AA 0201 .30 ± .03 BB 0402 .50 ± .05 CB 0603 .80 ± .07 CC 0603 .80 ± .10 CD ...

Page 4

CERAMIC CHIP CAPACITORS Tape & Reel Packaging 178mm (7.00") or 330mm (13.00") SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM Grid placement courtyard Dimension C X Calculation Formula Z = Lmin + 2Jt + ...

Page 5

TANTALUM, CERAMIC AND ALUMINUM CHIP CAPACITORS 1.0 Kg Minimum. The total peel strength of the cover tape from the carrier tape shall be The direction of the pull shall be opposite the direction of the carrier ...

Page 6

TANTALUM, CERAMIC AND ALUMINUM CHIP CAPACITORS Tape Camber (Top View) Tape Leader & Trailer Dimensions (Metric Dimensions Will Govern) Reel Dimensions (Metric Dimensions will govern 330.0 1.5 (12.992) (0.059 330.0 1.5 (12.992) (0.059) ©KEMET Electronics Corporation, ...

Page 7

CERAMIC CHIP CAPACITORS Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only): T Top Tape Cover Bottom Tape Cover T 1 User Direction of Feed Table 1: 8 & 12mm Punched Tape Constant Dimensions - Millimeters (Inches) Tape ...

Page 8

CERAMIC CHIP CAPACITORS Packaging Information 53.3* 10* 1.5 2.0 3.0 110 0.7 1005 0402 1.0 0.05 0.5 0.05 1608 0603 1.6 0.07 0.8 0.07 2012 0805 2.0 0.10 1.25 Terminations: KEMET nickel barrier layer with a tin overplate. A 0.10 ...

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