BD4154FV_10 ROHM [Rohm], BD4154FV_10 Datasheet - Page 11

• Manufacturer Part Number: BD4154FV_10
• Description: Power Switch IC for ExpressCard
• Manufacturer: ROHM [Rohm]

●Application Circuit (Circuit for ExpressCard
●Heat loss
BD4154FV
© 2010 ROHM Co., Ltd. All rights reserved.
www.rohm.com
Thermal design should allow the device to operate within the following conditions. Note that the temperatures listed are the
allowed temperature limits. Thermal design should allow sufficient margin from these limits.
Chip junction temperature Tj can be determined as follows:
①Chip junction temperature Tj is calculated from IC surface temperature TC under actual application conditions:
②Chip junction temperature Tj is calculated from ambient temperature Ta:
Most of heat loss in the BD4154FV occurs at the output switch. The power lost is determined by multiplying the
on-resistance by the square of output current of each switch.
1. Ambient temperature Ta can be no higher than 100°C.
2. Chip junction temperature Tj can be no higher more than 150°C.
Tj=TC+θj-cxW
＜Reference value＞
Tj=TC+θj-axW
＜Reference value＞
θj-c:SSOP-B20
θj-a:SSOP-B20
CPUSB#(2)
PERST#(6)
3.3Vaux(4)
CPPE#(1)
3.3V(3)
1.5V(5)
35 /W
250℃/W
153.8℃/W Single-layer substrate
(substrate surface copper foil area: less than 3%)
CPPE#(12pin)
CPUSB#(11pin)
V3(6,7pin)
V3AUX(17pin)
V15(13,14pin)
PERST#(8pin)
(IC only)
TM
Compliance Checklist)
BD4154FV
GND(10pin)
11/15
PERST_IN#(1pin)
V3AUX_IN(18pin)
V15_IN(15,16pin)
RCLKEN(19pin)
V3_IN(4,5pin)
SYSR(3pin)
EN(2pin)
Technical Note
2010.04 - Rev.B
3.3V(7)
3.3Vaux(8)
1.5V(9)
SysReset#(10)