CLD-AP90 CREE [Cree, Inc], CLD-AP90 Datasheet - Page 7

• Manufacturer Part Number: CLD-AP90
• Manufacturer: CREE [Cree, Inc]

Xlamp XB-d led refloW Soldering CharaCTeriSTiCS
In testing, Cree has found XLamp XB-D LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and
configurations of reflow soldering equipment.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
of Cree, Inc.
www.cree.com.
Profile Feature
Average Ramp-Up Rate (Ts
Preheat: Temperature Min (Ts
Preheat: Temperature Max (Ts
Preheat: Time (ts
Time Maintained Above: Temperature (T
Time Maintained Above: Time (t
Peak/Classification Temperature (Tp)
Time Within 5 °C of Actual Peak Temperature (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
min
to ts
max
max
)
min
to Tp)
max
)
L
)
)
L
)
xlamp xB-D leD solDering & hanDling
lead-Based Solder
3 °C/second max.
6 °C/second max.
60-120 seconds
60-150 seconds
6 minutes max.
10-30 seconds
100 °C
150 °C
183 °C
215 °C
lead-free Solder
3 °C/second max.
6 °C/second max.
60-180 seconds
60-150 seconds
8 minutes max.
20-40 seconds
150 °C
200 °C
217 °C
260 °C
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