SKIM459GD12E4_11 SEMIKRON [Semikron International], SKIM459GD12E4_11 Datasheet

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SKIM459GD12E4_11

Manufacturer Part Number
SKIM459GD12E4_11
Description
Trench IGBT Modules
Manufacturer
SEMIKRON [Semikron International]
Datasheet
SKiM459GD12E4
Trench IGBT Modules
SKiM459GD12E4
Features
• IGBT 4 Trench Gate Technology
• Solderless sinter technology
• V
• Low inductance case
• Isolated by Al
• Pressure contact technology for
• High short circuit capability, self limiting
• Integrated temperature sensor
Typical Applications*
• Automotive inverter
• High reliability AC inverter wind
• High reliability AC inverter drives
© by SEMIKRON
SKiM
coefficient
Bonded) ceramic substrate
thermal contacts and electrical
contacts
to 6 x I
CE(sat)
C
with positive temperature
®
93
2
O
3
GD
DCB (Direct Copper
Absolute Maximum Ratings
Symbol
IGBT
V
I
I
I
V
t
T
Inverse diode
I
I
I
I
T
Module
I
T
V
Characteristics
Symbol
IGBT
V
V
r
V
I
C
C
C
Q
R
t
t
E
t
t
E
R
C
Cnom
CRM
F
Fnom
FRM
FSM
t(RMS)
CES
psc
d(on)
r
d(off)
f
CE
CES
GES
j
j
stg
isol
CE(sat)
CE0
GE(th)
on
off
ies
oes
res
Gint
th(j-s)
G
Rev. 3 – 14.07.2011
T
V
V
V
T
t
T
I
V
chiplevel
V
V
V
V
V
V
T
V
I
R
R
di/dt
di/dt
Conditions
I
I
AC sinus 50 Hz, t = 1 min
Conditions
V
per IGBT
p
C
C
CRM
FRM
j
j
terminal
j
CC
GE
CES
GE
GE
GE
CE
CE
GE
GE
CC
GE
G on
G off
= 10 ms, sin 180°, T
= 175 °C
= 175 °C
= 450 A
= 25 °C
= 450 A
=V
= 1200 V
= 25 V
= 800 V
≤ 15 V
= 15 V
= 15 V
= 0 V
= 0 V
= - 8 V...+ 15 V
= 600 V
on
off
= 3xI
= 3xI
≤ 1200 V
= 1.3 
= 1.3 
= 8340 A/µs
= 3660 A/µs
CE
= 80 °C
, I
Fnom
Cnom
C
= 18 mA
T
T
T
T
T
T
T
T
T
T
T
T
T
f = 1 MHz
f = 1 MHz
f = 1 MHz
T
T
T
T
T
T
s
s
j
s
s
j
j
j
j
j
j
j
j
j
j
j
j
j
j
j
= 150 °C
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 25 °C
= 70 °C
= 25 °C
= 70 °C
= 25 °C
min.
5
-40 ... 175
-40 ... 175
-40 ... 125
-20 ... 20
Values
26.40
1200
1350
1350
2430
2500
2550
typ.
1.85
2.25
1.74
1.41
554
450
450
438
347
450
700
276
538
114
0.8
0.7
2.3
3.4
5.8
0.1
1.7
10
55
22
57
max.
0.092
2.10
2.45
0.9
0.8
2.7
3.7
6.5
0.3
Unit
Unit
K/W
m
m
mA
mA
nC
mJ
mJ
°C
°C
°C
nF
nF
nF
µs
ns
ns
ns
ns
V
A
A
A
A
V
A
A
A
A
A
A
V
V
V
V
V
V
1

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SKIM459GD12E4_11 Summary of contents

Page 1

SKiM459GD12E4 SKiM ® 93 Trench IGBT Modules SKiM459GD12E4 Features • IGBT 4 Trench Gate Technology • Solderless sinter technology • V with positive temperature CE(sat) coefficient • Low inductance case • Isolated DCB (Direct Copper 2 3 ...

Page 2

SKiM459GD12E4 SKiM ® 93 Trench IGBT Modules SKiM459GD12E4 Features • IGBT 4 Trench Gate Technology • Solderless sinter technology • V with positive temperature CE(sat) coefficient • Low inductance case • Isolated DCB (Direct Copper 2 3 ...

Page 3

SKiM459GD12E4 Fig. 1: Typ. output characteristic, inclusive R Fig. 3: Typ. turn-on /-off energy = f (I Fig. 5: Typ. transfer characteristic © by SEMIKRON Fig. 2: Rated current vs. temperature I CC'+ EE' ) Fig. 4: Typ. turn-on /-off ...

Page 4

SKiM459GD12E4 Fig. 7: Typ. switching times vs Fig. 9: Typ. transient thermal impedance Fig. 11: Typ. CAL diode peak reverse recovery current 4 Fig. 8: Typ. switching times vs. gate resistor R Fig. 10: Typ. CAL diode forward ...

Page 5

SKiM459GD12E4 SKIM 93 GD This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for ...

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