SKIM606GD066HD_11 SEMIKRON [Semikron International], SKIM606GD066HD_11 Datasheet

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SKIM606GD066HD_11

Manufacturer Part Number
SKIM606GD066HD_11
Description
5Trench IGBT Modules
Manufacturer
SEMIKRON [Semikron International]
Datasheet
SKiM606GD066HD
Trench IGBT Modules
SKiM606GD066HD
Features
• IGBT 3 Trench Gate Technology
• Solderless sinter technology
• V
• Low inductance case
• Isolated by Al
• Pressure contact technology for
• High short circuit capability, self limiting
• Integrated temperature sensor
Typical Applications*
• Automotive inverter
• High reliability AC inverter wind
• High reliability AC inverter drives
© by SEMIKRON
SKiM
coefficient
Bonded) ceramic substrate
thermal contacts and electrical
contacts
to 6 x I
CE(sat)
C
with positive temperature
®
63
2
O
3
GD
DCB (Direct Copper
Absolute Maximum Ratings
Symbol
IGBT
V
I
I
I
V
t
T
Inverse diode
I
I
I
I
T
Module
I
T
V
Characteristics
Symbol
IGBT
V
V
r
V
I
C
C
C
Q
R
t
t
E
t
t
E
R
C
Cnom
CRM
F
Fnom
FRM
FSM
t(RMS)
CES
psc
d(on)
r
d(off)
f
CE
CES
GES
j
j
stg
isol
CE(sat)
CE0
GE(th)
on
off
ies
oes
res
Gint
th(j-s)
G
Rev. 3 – 14.07.2011
T
V
V
V
T
t
T
I
V
chiplevel
V
V
V
V
V
V
T
V
I
R
R
di/dt
di/dt
Conditions
I
I
AC sinus 50 Hz, t = 1 min
Conditions
V
per IGBT
p
C
C
CRM
FRM
j
j
terminal
j
CC
GE
CES
GE
GE
GE
CE
CE
GE
GE
CC
GE
G on
G off
= 10 ms, sin 180°, T
= 175 °C
= 175 °C
= 600 A
= 25 °C
= 600 A
=V
= 600 V
= 25 V
= 360 V
≤ 15 V
= 15 V
= 15 V
= 0 V
= 0 V
= - 8 V...+ 15 V
= 300 V
on
off
= 2xI
= 2xI
≤ 600 V
= 3 
= 5 
= 5500 A/µs
= 6200 A/µs
CE
= 80 °C
, I
Fnom
Cnom
C
= 9.6 mA
T
T
T
T
T
T
T
T
T
T
T
T
T
f = 1 MHz
f = 1 MHz
f = 1 MHz
T
T
T
T
T
T
s
s
j
s
s
j
j
j
j
j
j
j
j
j
j
j
j
j
j
j
= 150 °C
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 25 °C
= 70 °C
= 25 °C
= 70 °C
= 25 °C
min.
5
-40 ... 175
-40 ... 175
-40 ... 125
-20 ... 20
Values
36.96
1200
1200
2880
2500
4800
1400
typ.
1.45
1.70
0.85
2.30
1.10
600
641
512
600
453
352
600
700
150
120
0.9
0.9
1.4
5.8
0.1
0.5
16
75
53
6
max.
0.105
1.85
2.10
0.9
1.4
2.0
6.5
0.3
1
Unit
Unit
K/W
m
m
mA
mA
nC
mJ
mJ
°C
°C
°C
nF
nF
nF
µs
ns
ns
ns
ns
V
A
A
A
A
V
A
A
A
A
A
A
V
V
V
V
V
V
1

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SKIM606GD066HD_11 Summary of contents

Page 1

SKiM606GD066HD SKiM ® 63 Trench IGBT Modules SKiM606GD066HD Features • IGBT 3 Trench Gate Technology • Solderless sinter technology • V with positive temperature CE(sat) coefficient • Low inductance case • Isolated DCB (Direct Copper 2 3 ...

Page 2

SKiM606GD066HD SKiM ® 63 Trench IGBT Modules SKiM606GD066HD Features • IGBT 3 Trench Gate Technology • Solderless sinter technology • V with positive temperature CE(sat) coefficient • Low inductance case • Isolated DCB (Direct Copper 2 3 ...

Page 3

SKiM606GD066HD Fig. 1: Typ. output characteristic, inclusive R Fig. 3: Typ. turn-on /-off energy = f (I Fig. 5: Typ. transfer characteristic © by SEMIKRON Fig. 2: Rated current vs. temperature I CC'+ EE' ) Fig. 4: Typ. turn-on /-off ...

Page 4

SKiM606GD066HD Fig. 7: Typ. switching times vs Fig. 9: Typ. transient thermal impedance Fig. 11: Typ. CAL diode peak reverse recovery current 4 Fig. 8: Typ. switching times vs. gate resistor R Fig. 10: Typ. CAL diode forward ...

Page 5

SKiM606GD066HD SKIM 63 GD This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for ...

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