PCF8579 Philips Semiconductors, PCF8579 Datasheet - Page 31

• Manufacturer Part Number: PCF8579
• Description: LCD column driver for dot matrix graphic displays
• Manufacturer: Philips Semiconductors

Philips Semiconductors
15 CHIP DIMENSIONS AND BONDING PAD LOCATIONS
1997 Apr 01
LCD column driver for dot matrix graphic
displays
Chip area: 14.37 mm
Bonding pad dimensions: 120 m
Gold bump dimensions (if ordered): 94
The numbers given in the square boxes refer to the pad number.
2
.
4.76
mm
V LCD
V DD
C39
C38
C37
C36
120 m.
n.c.
A2
A1
A0
V 3
V 4
94
10
11
12
13
14
15
16
17
18
19
20
21
8
9
25 m.
22
7
Fig.24 Bonding pad locations.
23
6
24
5
25
4
31
PCF8579
26
0
3.02 mm
3
0
27
y
2
28
1
56
29
55
30
54
31
53
32
52
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
51
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
C21
C22
MSA920
Product specification
x
PCF8579