UPC1676G39 NEC [NEC], UPC1676G39 Datasheet

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UPC1676G39

Manufacturer Part Number
UPC1676G39
Description
1.2 GHz BANDWIDTH LOW NOISE SILICON MMIC AMPLIFIER
Manufacturer
NEC [NEC]
Datasheet
1.UPC1676G39.pdf (5 pages)
• WIDE BANDWIDTH:
• HIGH POWER GAIN: 22 dB TYP AT f = 500 MHz
• HIGH ISOLATION
• SINGLE POWER SUPPLY: V
• INPUT/OUTPUT MATCHED TO 50
• AVAILABLE IN TAPE AND REEL (UPC1676G)
FEATURES
Note:
1. Case must be connected to GND for stable RF operation and optimum thermal dissipation.
DESCRIPTION
The UPC1676 is a silicon monolithic integrated circuit de-
signed for wide-band amplifiers covering the VHF to UHF
bands. The series is available in two package styles: a surface
mount package (UPC1676G), and an 8 lead ceramic flat
package (UPC1676B). Also available in chip form (UPC1676P).
NEC's stringent quality assurance and test procedures en-
sure the highest reliability and performance.
ELECTRICAL CHARACTERISTICS
SYMBOLS
1200 MHz at 3 dB Point for UPC1676G
1300 MHz at 3 dB Point for UPC1676B, UPC1676P
R
RL
ISOL
P
RL
TH(J-C)
BW
I
G
NF
CC
SAT
OUT
S
IN
Supply Current
Small Signal Gain
Saturated Output Power
Bandwidth 3 dB down from gain at 100 MHz
Noise Figure
Input Return Loss
Output Return Loss
Isolation
Thermal Resistance (Junction to Case)
PARAMETERS AND CONDITIONS
NOISE SILICON MMIC AMPLIFIER
PACKAGE OUTLINE
PART NUMBER
CC
= 5 V
1.2 GHz BANDWIDTH LOW
(T
A
= 25 C, V
CC
= 5 V, f = 500 MHz)
UNITS
dBm
MHz
C/W
mA
dB
dB
dB
dB
dB
1000 1300
MIN
3.5
14
18
18
10
24
UPC1676B
20
10
30
0
California Eastern Laboratories
60
TYP MAX MIN
B08
5.5
4.5
19
20
21
13
28
vs. FREQUENCY AND VOLTAGE
100
NOISE FIGURE AND GAIN
1
24
22
50
6
Frequency, f (MHz)
200
1000 1200
UPC1676G
14
19
24
3
9
6
G
NF
P
UPC1676G
TYP MAX MIN
4.5
39
19
22
12
28
5
9
V
CC
UPC1676B
UPC1676G
UPC1676P
500
= 5.5 V
24
24
V
6
CC
4.5 V
1000
= 5.5 V
1000 1300
5.0 V
4.5 V
5.0 V
14
19
24
3
UPC1676P
2000
CHIP
TYP MAX
4.5
19
22
21
13
28
5
5
0
10
24
24
6

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UPC1676G39 Summary of contents

Page 1

NOISE SILICON MMIC AMPLIFIER FEATURES • WIDE BANDWIDTH: 1200 MHz Point for UPC1676G 1300 MHz Point for UPC1676B, UPC1676P • HIGH POWER GAIN TYP 500 MHz • HIGH ISOLATION ...

Page 2

UPC1676B, UPC1676G, UPC1676P ABSOLUTE MAXIMUM RATINGS SYMBOLS PARAMETERS UNITS V Power Supply Voltage CC P Total Power Dissipation T UPC1676B/P UPC1676G T Operating Temperature OP UPC1676B/P UPC1676G T Storage Temperature STG UPC1676B/P UPC1676G Note: 1. Operation in excess of any ...

Page 3

TYPICAL PERFORMANCE CURVES UPC1676B/P NOISE FIGURE AND GAIN vs. FREQUENCY 100 200 500 Frequency, f (MHz) UPC1676G INSERTION POWER GAIN vs. FREQUENCY AND TEMPERATURE -40˚C A ...

Page 4

UPC1676B, UPC1676G, UPC1676P TYPICAL SCATTERING PARAMETERS UPC1676B FREQUENCY S 11 MHz MAG ANG 50 0.064 -11 100 0.064 -18 200 0.074 -40 400 0.095 -86 600 0.100 -130 800 0.105 ...

Page 5

UPC1676B, UPC1676G, UPC1676P OUTLINE DIMENSIONS UPC1676P (CHIP) (Units CHIP FEATURES • Die Size: 0. 0.65 mm • Thickness: 170 30 m • Pad Size: 100 m x 100 m • Ti/Pt/Au Metallization BONDING ...

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