UPC2711TB_1 NEC [NEC], UPC2711TB_1 Datasheet - Page 16

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UPC2711TB_1

Manufacturer Part Number
UPC2711TB_1
Description
5 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER
Manufacturer
NEC [NEC]
Datasheet
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) The bypass capacitor should be attached to V
(4) The DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
conditions than the recommended conditions are to be consulted with our sales representatives.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
16
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Method
This product should be soldered in the following recommended conditions.
Note After opening the dry pack, keep it in a place below 25 C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limit
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limit
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Count: 1, Exposure limit
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
Soldering Conditions
Note
Note
Note
Data Sheet P11510EJ3V0DS00
: None
: None
: None
CC
line.
PC2711TB,
Recommended Condition Symbol
Other soldering methods and
WS60-00-1
VP15-00-3
IR35-00-3
PC2712TB

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