IC-553-1-MF YAMAICHI [Yamaichi Electronics Co., Ltd.], IC-553-1-MF Datasheet

IC-553-1-MF

Manufacturer Part Number

IC-553-1-MF

Description

Dual InlineMemoryModule (DIMM, 160 pins)

Manufacturer

YAMAICHI [Yamaichi Electronics Co., Ltd.]

Datasheet

1.IC-553-1-MF.pdf (1 pages)

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IC553 Series

Outline Socket Dimensions

Specifications

Materials and Finish

Housing:

Contacts:

Plating:

Features

í Card thickness 1.57mm

Æ3.20 Thru hole

Insulation Resistance:

Dielectric Withstanding Voltage:

Contact Resistance:

Operating Temperature Range:

Mating Cycles:

Pin Count:

3.70 ±0.5

Polyetherimide (PEI), glass-filled

Beryllium Copper (BeCu)

Gold over Nickel

1.27x37=46.99 ±0.2

1.27 ±0.1

3.81 Ref

1.50

R 0.75

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

+ 0

0.1

102.87 ±0.2

108.00

141.00 ±0.2

132.00 ±0.4

150.00 ±0.4

110.50

1,000M min. at 500V DC

700V AC for 1 minute

30m max. at 10mA/20mV max.

–55°C to +170°C

10,000 insertions min.

160 contact pins

1.27x41=52.07 ±0.2

+ 0.2

2.54

+ 0.2

1.27 ±0.1

Dual Inline Memory Module

w0.40 x t0.30

Recommended PC Board Layout

Matching Module Dimensions

Æ3.20

1.27±0.05

1.27x37=46.99 ±0.1

46.99

+ 0.1

IC-553

Series No.

Design No.

MF = Flanged

Unmarked = Not Flanged

Part Number

102.87

104.65 Ref

110.24

(DIMM, 160 pins)

141.00 ±0.1

102.87 ±0.1

1.88 ±0.05

+ 0.26

– 0.25

(3.81)

1.27 ±0.05

(Details)

52.07

1.27x41=52.07 ±0.1

Top View from Socket

160- 0.80

Test & Burn-In

+ 0.1

1.57

±0.15

B-3

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