IC-595-1-MF YAMAICHI [Yamaichi Electronics Co., Ltd.], IC-595-1-MF Datasheet

IC-595-1-MF

Manufacturer Part Number

IC-595-1-MF

Description

Dual InlineMemoryModule (DIMM, 184 & 240 pins)

Manufacturer

YAMAICHI [Yamaichi Electronics Co., Ltd.]

Datasheet

1.IC-595-1-MF.pdf (1 pages)

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Outline Socket Dimensions

IC595 Series

Specifications

Æ3.20 Thru hole

Materials and Finish

Housing:

Contacts:

Plating:

Features

í Card thickness 1.27mm

í For 184 contact pins with 1.00mm pitch

Insulation Resistance:

Dielectric Withstanding Voltage:

Contact Resistance:

Operating Temperature Range:

Mating Cycles:

Pin Count:

1.00x45=45.00 ±0.2

3.50 ±0.5

Polyetherimide (PEI), glass-filled

Beryllium Copper (BeCu)

Gold over Nickel

1.60

-0.1

11.50±0.1

1.00 ±0.15

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

Section "A"

122.00 ±0.2

32.00 ±0.2

108.00

153.70 ±0.4

162.70 ±0.2

171.70 ±0.4

153.70 ref

128.00 ref

1,000M min. at 500V DC

700V AC for 1 minute

30m max. at 10mA/20mV max.

–55°C to +170°C

10,000 insertions minimum

184 contact pins

R 0.80

+ 0.2

Section "A"

1.00 ±0.1

Dual Inline Memory Module

1.00x45=45.00 ±0.2

w0.30 x t0.30

Recommended PC Board Layout

Matching Module Dimensions

1.00x45=45.00 ±0.1

Æ3.20

Thru hole

1.00x45=45.00 ±0.1

3.00

1.00±0.05

4.00±0.15

IC-595

Series No.

1 = 184 Pins

2 = 240 Pins

MF = Flanged

Unmarked = Not Flanged

Part Number

+ 0.1

4.50

11.50

133.35±0.15

102.87

(DIMM, 184 & 240 pins)

2.00±0.1

27.50

162.70 ±0.1

122.0 ±0.1

32.0 ±0.1

(Details)

1.00x45=45.00 ±0.1

1.00 ±0.05

Top View from Socket

Thru hole

184- 0.80

Test & Burn-In

+ 0.1

1.27±0.1

B-5

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