MAX5054 MAXIM [Maxim Integrated Products], MAX5054 Datasheet - Page 12

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MAX5054

Manufacturer Part Number
MAX5054
Description
4A, 20ns, Dual MOSFET Drivers
Manufacturer
MAXIM [Maxim Integrated Products]
Datasheet

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Both the SO-EP and TDFN-EP packages have an
exposed pad on the bottom of their package. These
pads are internally connected to GND. For the best
thermal conductivity, solder the exposed pad to the
4A, 20ns, Dual MOSFET Drivers
Figure 5. Push-Pull Converter with Synchronous Rectification Drive Using MAX5054
12
PWM IN
PWM IN
______________________________________________________________________________________
INA+
INA-
INB+
INB-
MAX5054
V
IN
OUTA
OUTB
GND
V
DD
V
DD
Exposed Pad
PWM IN
ground plane to dissipate 1.5W and 1.9W in SO-EP and
TDFN-EP packages, respectively. Do not use the
ground-connected pads as the only electrical ground
connection or ground return. Use GND (pin 3) as the
primary electrical ground connection.
Additional Application Circuits
INA+
INA-
INB+
INB-
MAX5054
OUTA
OUTB
GND
V
DD
V
OUT

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