LM2672LD-12 NSC [National Semiconductor], LM2672LD-12 Datasheet - Page 22

• Manufacturer Part Number: LM2672LD-12
• Manufacturer: NSC [National Semiconductor]

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LLP PACKAGE DEVICES
The LM2672 is offered in the 16 lead LLP surface mount
package to allow for increased power dissipation compared
to the SO-8 and DIP.
22
The Die Attach Pad (DAP) can and should be connected to
PCB Ground plane/island. For CAD and assembly guidelines
refer
power.national.com.
to
Application
Note
AN-1187
at
http://