STR752FR1H7 STMICROELECTRONICS [STMicroelectronics], STR752FR1H7 Datasheet - Page 79

• Manufacturer Part Number: STR752FR1H7
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

STR750Fxx STR751Fxx STR752Fxx STR755Fxx
6.2
6.2.1
Thermal characteristics
The maximum chip junction temperature (T
Table 10: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
Table 48.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
environment.
Symbol
–
–
–
–
–
Θ
Θ
Θ
Θ
JA
JA
JA
JA
T
Θ
P
P
chip internal power.
P
Where:
P
taking into account the actual V
level in the application.
Amax
Dmax
INTmax
I/Omax
I/Omax
JA
Thermal characteristics
is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,
Thermal Resistance Junction-Ambient
LQFP 100 - 14 x 14 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LFBGA 64 - 8 x 8 x 1.7mm
Thermal Resistance Junction-Ambient
LFBGA 100 - 10 x 10 x 1.7mm
is the maximum Ambient Temperature in °C,
is the sum of P
= Σ (V
represents the maximum Power Dissipation on Output Pins.
is the product of I
OL
*I
OL
) + Σ((V
T
INTmax
Jmax
Parameter
DD
= T
DD
(1)
and P
and V
Amax
-V
OL
OH
Jmax
Jmax
/ I
I/Omax
DD
)*I
+ (P
OL
, expressed in Watts. This is the maximum
OH
) must never exceed the values given in
, in degrees Celsius, may be calculated
34.
and V
Dmax
),
(P
Dmax
OH
x Θ
/ I
JA
= P
OH
)
INTmax
of the I/Os at low and high
Package characteristics
+ P
Value
46
45
58
41
I/Omax
),
°C/W
°C/W
°C/W
°C/W
Unit
79/84