LE3330-PF LIGITEK [LIGITEK electronics co., ltd.], LE3330-PF Datasheet

no-image

LE3330-PF

Manufacturer Part Number
LE3330-PF
Description
ROUND TYPE LED LAMPS
Manufacturer
LIGITEK [LIGITEK electronics co., ltd.]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LE3330-PF
Manufacturer:
LIGITEK
Quantity:
40 000
ROUND TYPE LED LAMPS
DOC. NO :
REV.
DATE
DATA SHEET
LE3330-PF
:
:
QW0905-
A
27 - Feb.
LIGITEK ELECTRONICS CO.,LTD.
- 2006
LE3330-PF
Property of Ligitek Only
Lead-Free Parts
Pb

Related parts for LE3330-PF

LE3330-PF Summary of contents

Page 1

... ROUND TYPE LED LAMPS DOC REV. DATE LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LE3330-PF DATA SHEET LE3330-PF QW0905 Feb. - 2006 Pb Lead-Free Parts ...

Page 2

... PART NO. LE3330-PF Package Dimensions 1.5MAX Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5.0 7.6 □ 0.5 TYP 2.54TYP + - 5.9 8.6 25.0MIN 1.0MIN Page 1/5 ...

Page 3

... Operating Temperature Storage Temperature Typical Electrical & Optical Characteristics (Ta=25 PART NO MATERIAL Emitted LE3330-PF GaAsP/GaP Orange Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ℃ ...

Page 4

... PART NO. LE3330-PF Typical Electro-Optical Characteristics Curve E CHIP Fig.1 Forward current vs. Forward Voltage 1000 100 10 1.0 0.1 1.0 2.0 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 -40 - Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 550 600 650 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. 3.0 4.0 5 100 700 750 Property of Ligitek Only Fig ...

Page 5

... PART NO. LE3330-PF Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° ...

Page 6

... PART NO. LE3330-PF Reliability Test: Test Item 1.Under Room Temperature Operating Life Test 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature 1.Ta=105 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature 1.Ta=-40 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 High Temperature 2.RH=90 %~95 % High Humidity Test 3.t=240hrs 1.Ta=105 ...

Related keywords